AMD EPYC 7262 8-Core 3.2GHz Processor, SP3 Socket, 128MB Cache

VENDOR: AMD Mfg Part#: 100-000000041
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Regular price $676.00
Regular price Sale price $676.00
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MSRP: $710.00
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  • 8-Core / 16-Thread AMD EPYC architecture
  • 3.2 GHz base clock with 3.4 GHz boost frequency
  • 128MB L3 cache for enhanced data handling
  • Socket SP3 compatibility
  • 155W Thermal Design Power (TDP)

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Key Benefits

Eye-Insights
  • Ideal for virtualized workloads and multi-threaded applications due to 8-core/16-thread design
  • High 128MB L3 cache optimizes data throughput in demanding environments
  • Socket SP3 support enables compatibility with modern server motherboards

Product Overview

The AMD EPYC 7262 processor offers enterprise-class capabilities in a compact 8-core, 16-thread architecture. Designed for Socket SP3 infrastructure, this processor delivers a base clock speed of 3.2 GHz and supports a maximum turbo boost frequency of 3.4 GHz, providing efficient computational power for multitasking, virtualization, and server workloads. With a generous 128MB of L3 cache, it delivers fast data access and reduced bottlenecks to enhance performance across business-critical applications.

Engineered with a 155W thermal design power (TDP), the EPYC 7262 balances its power consumption while offering robust performance. Integrated with AMD's notable EPYC architecture, it is a reliable option for scalable server deployments in data centers or on-premise infrastructures. This processor benefits users looking for an affordable yet capable processor in environments requiring moderate to high parallel compute throughput.

Whether used in entry-level to mid-tier server configurations, the AMD EPYC 7262 offers a solid return on investment through its multi-core capabilities and efficient energy usage. While country of origin and TAA compliance information require inquiry, the core processor attributes make this a dependable foundation for business-scale computing.

Specifications

Product Overview

Processor Type AMD EPYC
Model Number 7262
Number of Cores 8
Number of Threads 16
Base Clock Frequency 3.2 GHz
Max Turbo Frequency 3.4 GHz
L3 Cache Size 128 MB
Architecture Zen 2
Manufacturing Process 7nm FinFET
Platform Compatibility Server
Thermal Design Power (TDP) 155 W
Form Factor Socketed (SP3)

Physical & Environmental

Package Type Socket SP3 (LGA4094)
Die Size Approx. 192 mm² per chiplet
Number of Die Chiplets 1 x CCD, 1 x IOD
Max Operating Temperature (Tjunction) 95°C
Integrated Heat Spreader Yes

Cloud Management & Licensing

Virtualization Support Yes—AMD-V
Secure Encrypted Virtualization (SEV) Yes
Cloud-Scale Deployment Ready Yes
License Type OEM / Tray or PIB depending on distribution

Interfaces

Socket Type Socket SP3
PCI Express Version PCIe 4.0
PCI Express Lanes 128
Memory Interface 8-channel DDR4
Supported Memory Speed Up to 3200 MHz
Supported Memory Type DDR4 RDIMM/LRDIMM
Memory Bandwidth Up to 204.8 GB/s

Compliance & Origin

Country of Origin
TAA Compliant
RoHS Compliant Yes
Halogen Free Yes
ECC Memory Support Yes

Advanced Security Features

AMD Secure Processor Yes
Secure Memory Encryption (SME) Yes
Secure Encrypted Virtualization (SEV) Yes
Hardware Root of Trust Yes