| Processor Type | AMD EPYC | 
| Model Number | EPYC 7272 | 
| Base Clock Speed | 2.9 GHz | 
| Max Turbo Frequency | 3.2 GHz | 
| Number of CPU Cores | 12 | 
| Number of Threads | 24 | 
| Socket Type | SP3 | 
| Thermal Design Power (TDP) | 120 W | 
| L3 Cache Size | 64 MB | 
| L2 Cache Size | 6 MB | 
| Process Technology | 7 nm | 
| Architecture | Zen 2 | 
| Platform | Server | 
| Integrated Graphics | No | 
| Form Factor | Server/Workstation CPU | 
AMD EPYC 7272 12-Core 2.9GHz SP3 Server Processor
 
 
 
 

Key Benefits
 
            
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- Delivers strong multi-threaded performance suited for enterprise workloads with 12 cores and 24 threads
- Balanced power efficiency and processing capability with a 120W TDP and 64MB L3 cache
- Supports upgradeable infrastructure with SP3 socket compatibility for EPYC server systems
Product Overview
The AMD EPYC 7272 is a powerful 12-core server processor from AMD’s EPYC series, crafted for data centers and business-critical server infrastructure. With its base clock of 2.9 GHz and turbo boost up to 3.2 GHz, it provides robust multithreaded performance, supporting 24 simultaneous threads. This makes it well-suited for demanding environments including virtualization, distributed computing, and software-defined storage.
Outfitted with a generous 64MB of L3 cache, the EPYC 7272 ensures high bandwidth and low latency data access, enhancing processing efficiency under heavy workload conditions. Operating at a 120W TDP, it strikes a balance between performance and energy consumption. This model uses the SP3 socket type, compatible with a wide range of EPYC-based server motherboards.
Ideal for organizations seeking scalable and reliable compute performance, the AMD EPYC 7272 provides an optimal cost-per-core ratio for mid-range enterprise deployments where predictable performance and manageability are crucial. Additional compliance or country of origin data are not available from the provided input.
Specifications
                      Product Overview
                      
                    
                    
                      Physical & Environmental
                      
                    
                    | Package Type | Socket SP3 | 
| Heatsink Included | No | 
| Cooling Solution | Not included | 
| Die Size | Estimated 192 mm² (IOD) + multiple CCDs | 
| Operating Temperature Range | 0°C to 95°C (Tcase Max) | 
| Power Supply Requirements | Compatible server PSU required | 
                      Cloud Management & Licensing
                      
                    
                    | Virtualization Support | Yes – AMD-V | 
| Scalability | Up to 2 sockets | 
                      Interfaces
                      
                    
                    | PCI Express Version | PCIe 4.0 | 
| PCI Express Lanes | 128 | 
| Memory Interface | 8 channels DDR4 | 
| Maximum Memory Speed Supported | DDR4-3200 | 
                      Compliance & Origin
                      
                    
                    | Country of Origin | |
| TAA Compliance | |
| RoHS Compliance | Yes | 
| ECC Memory Support | Yes | 
| Platform Security Features | Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV) | 
                      Advanced Security Features
                      
                    
                    | Hardware Security Features | AMD Infinity Guard | 
| Secure Boot | Yes | 
| Memory Encryption | Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV-ES) | 
 
               
     
     
     
    