Processor Type | AMD EPYC |
Model Number | 7352 |
Number of Cores | 24 |
Number of Threads | 48 |
Base Clock Speed | 2.3 GHz |
Max Turbo Frequency | 3.2 GHz |
Socket Type | Socket SP3 |
Thermal Design Power (TDP) | 155 Watt |
L3 Cache | 128 MB |
Integrated Graphics | None |
Processor Family | EPYC 7002 Series |
Manufacturing Process | 7nm FinFET |
Launch Date | Q3 2019 |
Architecture | Zen 2 |
Form Factor | Server Processor |
AMD EPYC 7352 24-Core 2.3GHz Server Processor





Key Benefits

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- Exceptional core and thread count enables efficient multitasking and high-density virtualization.
- Large 128MB cache improves data throughput and performance in compute-heavy environments.
- Compatible with Socket SP3 platforms, offering seamless integration into current infrastructures.
Product Overview
The AMD EPYC 7352 is engineered for next-generation server workloads that demand high core density and substantial memory bandwidth. Featuring 24 physical cores and simultaneous multithreading for a total of 48 threads, it operates at a 2.3 GHz base clock with dynamic boosting up to 3.2 GHz for intensive tasks. Its 128MB of L3 cache accelerates data access across applications such as virtualization, database processing, and high-performance computing.
Designed for Socket SP3 platforms, the EPYC 7352 supports 8-channel DDR4 DRAM configurations, providing immense throughput for memory-intensive applications. With a 155W Thermal Design Power (TDP), it balances performance and energy efficiency for dense computing environments. The absence of onboard graphics allows for focused compute processing while integrating seamlessly into existing GPU-accelerated workflows when needed.
Ideal for enterprises modernizing their servers or deploying new infrastructures, the EPYC 7352 offers scalable compute with significant return on investment due to core density and platform compatibility. Manufactured across compliant international locations, it enables deployment flexibility across global datacenters.
Specifications
Product Overview
Physical & Environmental
Operating Temperature (Tcase) | Up to 90°C |
Approximate Weight | Approximately 0.9 lb (0.4 kg) |
Heatsink Included | No |
Package Type | FC-LGA (Flip-Chip Land Grid Array) |
Die Count | 4 chiplets + 1 I/O die |
Cloud Management & Licensing
Virtualization Support | Yes: AMD-V |
Interfaces
Memory Interface | 8-channel DDR4-3200 |
Memory Type Supported | DDR4 |
Memory Channels | 8 |
Max Memory Speed | 3200 MHz |
PCI Express Version | PCIe 4.0 |
PCI Express Lanes | 128 |
Compliance & Origin
Country of Origin | Malaysia / China / Taiwan / South Korea |
TAA Compliant | No |
RoHS Compliance | Yes |
ECC Memory Support | Yes |
Reliability, Availability & Serviceability (RAS) | Yes |
Advanced Security Features
Hardware Security Features | AMD Secure Processor |
Encrypted Virtualization | AMD SEV (Secure Encrypted Virtualization) |
Secure Memory Encryption (SME) | Yes |
Secure Boot Support | Yes |