Processor Type | AMD EPYC 7502 |
Processor Family | AMD EPYC 7002 Series (Rome) |
Number of Cores | 32 |
Number of Threads | 64 |
Base Clock Speed | 2.5 GHz |
Max Boost Clock | 3.35 GHz |
L3 Cache | 128 MB |
Thermal Design Power (TDP) | 180 W |
Manufacturing Technology | 7 nm |
Processor Socket | Socket SP3 |
Integrated Graphics | No |
Architecture | x86-64 |
Instruction Set Extensions | AVX2, SSE4.2 |
Platform | Server |
AMD EPYC 7502 32-Core 2.5GHz Server Processor




Key Benefits

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- Delivers exceptional multi-threaded performance ideal for virtualization and database workloads
- Supports large memory bandwidth with 8-channel DRAM and robust 128MB L3 cache
- Built for modern enterprise reliability with versatile international manufacturing and SP3 socket compatibility
Product Overview
The AMD EPYC 7502 is a high-performance 32-core server processor optimized for compute-intensive enterprise tasks. It offers 64 threads of parallel processing, a base clock speed of 2.5 GHz with a boost up to 3.35 GHz, and a thermal design power (TDP) of 180W. The processor includes 128MB of L3 cache and supports 8 memory channels with DRAM. It uses the Socket SP3 platform and is manufactured in multiple international facilities. While not TAA-compliant, it offers an exceptional return on investment for large-scale workloads like virtualization, cloud computing, and data-intensive tasks.
Specifications
Product Overview
Memory Support
Memory Types Supported | DDR4-3200 |
Number of Memory Channels | 8 |
Max Memory Bandwidth | 204.8 GB/s |
ECC Memory Support | Yes |
Max Memory Size | 4 TB |
Compliance & Origin
Country of Origin | Malaysia / China / Taiwan / South Korea |
TAA Compliant | No |
RoHS Compliant | Yes |
Halogen Free | Yes |
Cloud Management & Licensing
Licensing Model | Per Socket/Per Core Subscription Model (varies by vendor) |
Cloud Optimization | Yes (Optimized for Virtualization and Cloud Workloads) |
Interfaces
PCI Express Version | PCIe 4.0 |
PCI Express Lanes | 128 |
Physical & Environmental
Processor Package | Organic Land Grid Array (LGA) |
Die Size | Estimated 260 mm² (CCD) |
Operating Temperature (Max) | 95°C |
Advanced Security Features
Security Features | Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV), Hardware Root of Trust |
Hardware Virtualization | AMD-V |
Boot Secure | Yes |
Trusted Platform Module (TPM) Support | TPM 2.0 (via platform support) |