Processor Type | AMD EPYC |
Model Number | 7702P |
Form Factor | Server Processor (Single-Socket) |
Base Clock Speed | 2 GHz |
Max Turbo Frequency | 3.35 GHz |
Number of Cores | 64 |
Number of Threads | 128 |
Thermal Design Power (TDP) | 200 W |
Packaging Type | Retail Boxed |
AMD EPYC 7702P 64-Core 2GHz SP3 Server Processor





Key Benefits

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- High core and thread count ideal for virtualization, HPC, and cloud workloads
- Large L3 cache and multi-channel memory support boost performance for data-heavy operations
- Single-socket architecture lowers infrastructure cost while maintaining enterprise-grade performance
Product Overview
The AMD EPYC 7702P is built to handle the most demanding server environments thanks to its impressive 64-core architecture and support for 128 simultaneous threads. Designed for compatibility with Socket SP3 motherboards, this processor is tailored for data centers, virtualization, high-performance computing, and cloud applications that require massive parallel processing power. The base clock speed of 2 GHz provides consistent performance, while the 3.35 GHz max turbo frequency supports boosted single-thread performance when needed.
With a large 256 MB L3 cache and Thermal Design Power (TDP) of 200W, the EPYC 7702P ensures high throughput and energy efficiency under sustained workloads. It supports eight memory channels and DRAM, enabling extensive memory bandwidth and scalability for memory-intensive applications. The lack of an integrated graphics controller reflects its focus on headless server deployments where GPU workloads are offloaded or unnecessary. TAA non-compliance may be relevant for certain government procurement processes.
The EPYC 7702P delivers an excellent return on investment for organizations that require high-density computing and efficiency in a single socket solution. Its ability to consolidate performance, power management, and memory handling in one processor suits modern IT infrastructures striving to reduce total cost of ownership (TCO) and increase compute density.
Specifications
Product Overview
Physical & Environmental
Package Size (L x W) | 76 mm x 56 mm |
Heatsink Included | No |
Average CPU Temperature (Typical Operation) | 60°C – 70°C |
Maximum Operating Temperature | 95°C |
Cooling Solution | Not included |
Cloud Management & Licensing
Cloud Optimization | Yes, designed for cloud workloads |
Platform Support | EPYC 7002 Series Platform Ecosystem |
Socket Scalability | Single-socket support only |
Integrated Management Controller | No |
Additional Technical Details
L3 Cache | 256 MB |
Manufacturing Process | 7nm FinFET |
Architecture | Zen 2 |
Max # of Supported DIMMs | 16 DIMMs per socket |
ECC Memory Support | Yes |
Integrated Graphics | None |
Interfaces
Socket Type | SP3 |
PCI Express Version | PCIe 4.0 |
Number of PCIe Lanes | 128 |
Memory Interface | 8-Channel DDR4 |
Supported Memory Type | DDR4-3200 |
Max Memory Bandwidth | 204.8 GB/s |
Compliance & Origin
Country of Origin | Malaysia / China / Taiwan / South Korea |
TAA Compliant | No |
RoHS Compliance | Yes |
Halogen Free | Yes |
Advanced Security Features
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
AMD Infinity Guard | Yes |
Hardware Root of Trust | Yes |