Products Memory, Storage and Components AMD EPYC 9174F 16-Core 4.4G...

AMD EPYC 9174F 16-Core 4.4GHz Server Processor, Socket SP5

VENDOR: AMD Mfg Part#: 100-000000796
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$3,830.00
$3,830.00
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MSRP: $5,476.00
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  • - 16-core / 32-thread AMD EPYC processor for high-throughput server workloads
  • - 4.1 GHz base clock speed with 4.4 GHz max turbo frequency
  • - 256MB of L3 cache for optimized data access and performance
  • - Supports 12-channel DRAM, enhancing memory bandwidth
  • - Compatible with Socket SP5 motherboards for enterprise platforms
  • - TDP rated at 320W for power-intensive server infrastructures

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Key Benefits

Eye-Insights
  • - Equipped with 32 threads and high clock speeds (up to 4.4 GHz), ideal for multi-threaded high-performance computing tasks
  • - Large 256MB L3 cache and 12-channel DRAM support enable rapid data handling and reduced latency
  • - Enterprise-grade 320W TDP and Socket SP5 compatibility make it viable for modern data center deployments

Product Overview

The AMD EPYC 9174F is a data-center optimized 16-core processor designed to handle virtualization, in-memory analytics, and cloud infrastructure. Its 4.1 GHz base and 4.4 GHz turbo frequencies provide high-throughput performance, while 32 threads and 256MB of L3 cache help manage parallel loads efficiently. Integrated with support for 12-channel DRAM and built on the Socket SP5 platform, this processor is ready for scalable enterprise deployments. With a TDP of 320W, it's engineered to power compute-heavy infrastructure, although it doesn’t include integrated graphics and is not TAA compliant.

Specifications

Product Overview
Processor Type AMD EPYC
Model Number 9174F
Socket Type SP5
Number of Cores 16
Number of Threads 32
Base Clock Speed 4.1 GHz
Max Turbo Frequency 4.4 GHz
L3 Cache 256 MB
TDP (Thermal Design Power) 320 W
Integrated Graphics None
Memory Channels Supported 12
Memory Type DDR5
Processor Generation 4th Gen EPYC (Genoa)
Manufacturing Technology 5nm FinFET
Form Factor Server (Socketed CPU)
Launch Date 2022

Physical & Environmental
Package Type FC-LGA (Flip-Chip Land Grid Array)
Package Size 72 mm x 75.4 mm
Operating Temperature Range 10°C to 85°C
Storage Temperature -40°C to 90°C
Cooling Requirement Passive or active (direct contact HS/Fan required)

Cloud Management & Licensing
Enterprise Ready Yes
Supported Virtualization Technologies AMD-V, SEV, SEV-ES, SEV-SNP

Interfaces
PCIe Version PCIe 5.0
Number of PCIe Lanes 128
Memory Interface 12-channel DDR5
Socket Compatibility Socket SP5 (LGA 6096)

Compliance & Origin
Country of Origin Malaysia
RoHS Compliant Yes
Halogen Free Yes
TAA Compliant No
Compliance Standards RoHS, WEEE

Advanced Security Features
Secure Boot Yes
AMD Infinity Guard Yes
Secure Encrypted Virtualization Yes
Memory Encryption Yes
Hardware Root of Trust Yes