Processor Type | AMD EPYC |
Model | 9554P |
Number of Cores | 64 |
Number of Threads | 128 |
Base Clock Speed | 3.1 GHz |
Max Boost Clock | 3.7 GHz |
L3 Cache Size | 256 MB |
Thermal Design Power (TDP) | 360 W |
Socket Type | Socket SP5 |
Form Factor | Tray (OEM only) |
Processor Count | 1 |
AMD EPYC 9554P 64-Core 3.1GHz Server Processor




Key Benefits

Eye-Insights™ by Eye-In Technologies
AI-Powered Summaries from Online Customer Reviews
AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- Offers extremely high core and thread counts ideal for virtualization and large-scale parallel applications
- Supports advanced memory throughput via 12-channel DRAM configuration, crucial for data-intensive workloads
- Maximizes ROI in data centers by reducing total processor count and optimizing power-performance ratio
Product Overview
The AMD EPYC 9554P is a 64-core/128-thread server processor with a base clock of 3.1 GHz and max boost of 3.7 GHz, purpose-built for demanding virtualization, cloud, and AI workloads. It features 256 MB of L3 cache, a 360W TDP, and supports 12 DRAM memory channels through a Socket SP5 interface. This high-density CPU enables scalable performance for enterprise deployments, offering significant compute throughput and memory bandwidth in a tray configuration designed for OEMs and integrators.
Specifications
Product Overview
Wireless Features
Compliance & Origin
Country of Origin | Malaysia |
TAA Compliant | No |
RoHS Compliant | Yes |
ECC Memory Support | Yes |
Manufacturing Process | 5nm FinFET (TSMC) |
Advanced Security Features
AMD Infinity Guard | Yes |
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
Shadow Stack | Yes |
Hardware Root of Trust | Yes |
OS and VM Isolation | Yes |
Interfaces
Memory Interface | 12-channel DDR5 |
Supported Memory Types | DDR5 DRAM |
PCI Express Version | PCIe 5.0 |
PCIe Lane Count | 128 |
Physical & Environmental
Package Type | LGA (Land Grid Array) |
Processor Package Dimensions | 76mm x 80mm (approximate) |
Maximum Operating Temperature (Tj Max) | 95°C |
Operating Temperature Range | 10°C to 80°C |
Heatsink Included | No |
Cooling Solution | Not included |
Cloud Management & Licensing
Market Segment | Datacenter / Enterprise |
Intended Use | Server / HPC / Cloud / Virtualization |
Bundled Software | None |
Licensing Type | OEM Tray |