Processor Type | Server Processor |
Processor Series | AMD EPYC |
Model | 8124PN |
Number of Cores | 16 |
Number of Threads | 32 |
Base Clock Speed | 2.3 GHz |
Max Boost Clock | 3.0 GHz |
L3 Cache | 32 MB |
L2 Cache | 8 MB |
Manufacturing Process | 14nm |
Thermal Design Power (TDP) | 180W |
Socket Type | Socket SP3 |
Form Factor | FC-LGA14 |
AMD EPYC (Sixteen-Core) Model 8124PN Server Processor



Key Benefits

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- - Sixteen-core architecture provides excellent scalability for virtualization and high-performance computing workloads
- - Belongs to the EPYC-Series, known for balanced compute density and data center optimization
- - Designed specifically for enterprise server environments, ensuring dependable deployment in commercial infrastructures
Product Overview
The AMD EPYC (Sixteen-Core) Model 8124PN is engineered to handle high-performance server tasks, offering sixteen cores to support robust parallel processing. This processor is built to serve demanding data center environments, including cloud computing, virtualization, and enterprise databases, where multitasking and workload consolidation are critical to infrastructure optimization. Its architecture is tailored to deliver consistent throughput and responsiveness under load.
Manufactured in Malaysia, the 8124PN is part of AMD’s EPYC server processor family and is classified under the AMD EPYC-Series. Though it is not TAA compliant, it is intended for deployment in commercial environments where TAA restrictions do not apply. The product supports configurations typically needed in server installations where core count is a key factor, offering a balanced mix of compute density and power efficiency for scalable enterprise systems.
Specific technical specifications—such as base frequency, cache size, power consumption, and supported technologies—have not been provided, so performance comparisons or configuration guidance must be based on core count and product classification alone. For full deployment planning or hardware matching, additional datasheet information would be needed from the manufacturer or distributor.
Specifications
Product Overview
Physical & Environmental
Package Size | 58.5mm x 75.4mm |
Operating Temperature Range | 10°C to 80°C |
Storage Temperature Range | -40°C to 90°C |
Cooling Solution | Not included |
Heatsink Compatibility | SP3-compatible |
Cloud Management & Licensing
Designed for Virtualization | Yes |
AMD Infinity Architecture | Yes |
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
Interfaces
PCIe Version | PCIe 3.0 |
PCIe Lanes | 128 |
Memory Support | DDR4 |
Memory Interface | 8-channel |
Max Memory Speed | DDR4-2666 |
Max Memory Capacity | 2 TB |
Compliance & Origin
Country of Origin | Malaysia |
TAA Compliant | No |
RoHS Compliant | Yes |
Halogen Free | Yes |
Reach Compliant | Yes |
ECC Memory Support | Yes |
Advanced Security Features
AES Support | Yes |
NX Bit | Yes |
AMD GuardMI Technology | Yes |
Hardware Virtualization | Yes |