Product Type | Processor heatsink |
Component Type | CPU Heatsink |
Compatible Processor Series | Intel Xeon Scalable (3rd Gen) |
Form Factor | Blade server accessory |
Weight | Approx. 1.2 lbs (0.54 kg) |
Mounting Position | Rear CPU socket |
Power Requirements | Passive cooling component; no direct power required |
Cisco UCSB-HS-M6-R= CPU Heatsink for UCS B-Series M6 (Rear Mount)

Key Benefits

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- Built specifically for UCS B-Series M6 servers, ensuring a precise mechanical and thermal fit
- TAA compliance enables deployment in government-regulated IT environments
- High-efficiency thermal design enhances CPU longevity and system stability
Product Overview
The Cisco UCSB-HS-M6-R= is a high-performance processor heatsink engineered for the rear CPU socket on UCS B-Series M6 Blade Servers. Designed for use in models like the UCSB-B200-M6-U and various UCSB-5108 chassis configurations, it provides targeted thermal management in high-density computing environments. TAA compliance and origin in CHINA / UNITED STATES make it suitable for regulated deployments. Ideal for ensuring system longevity and performance, it forms part of a critical infrastructure for thermal control in data centers.
Specifications
Product Overview
Physical & Environmental
Dimensions (W x H x D) | 3.2 x 2.4 x 4.7 in (approx.) |
Operating Temperature | 10°C to 35°C (50°F to 95°F) |
Storage Temperature | -40°C to 70°C (-40°F to 158°F) |
Operating Humidity | 5% to 93% (non-condensing) |
Heat Dissipation Capacity | Supports high thermal design power (TDP) CPUs |
Cooling Method | Passive heatsink, chassis-driven airflow |
Compatibility
Designed For | Cisco UCS B200 M6 Blade Servers |
Compatible Chassis | Cisco UCS 5108 Series |
Installation Position | Rear CPU Socket Only |
Compatible Part Numbers | UCSB-5108-AC2, UCSB-5108-DC2, UCSB-B200-M6-U, etc. |
Advanced Security Features
Integrated Security | Not applicable |
Interfaces
Interface Type | Direct-contact thermal interface |
Base Material | Copper with aluminum-finned heatsink |
Thermal Interface Material (TIM) | Pre-applied TIM pad |
Compliance & Origin
Country of Origin | China or United States |
TAA Compliant | Yes |
RoHS Compliance | Yes |
Halogen-Free | Yes |
REACH Compliant | Yes |
Cloud Management & Licensing
Management Interface | |
Licensing Requirements | None (passive accessory) |
Smart Licensing Support | Not applicable |
Packaging & Materials
Heatsink Finish | Nickel-plated base |
Packaging Type | OEM anti-static packaging |
Included Accessories | Pre-applied thermal compound |
Heatsink Type | High-density fin stack |