System Type | Thin Client |
Form Factor | Small Form Factor (SFF) |
Processor Type | AMD Ryzen Embedded |
Processor Model | R1505G |
Processor Clock Speed | 2.4 GHz |
Number of Cores | 2 |
Number of Threads | 4 |
Cache Type | L3 cache |
Cache Size | 4 MB |
Installed RAM | 8 GB |
Maximum RAM Supported | 32 GB |
RAM Technology | DDR4 |
Installed Flash Storage | 32 GB |
Maximum Flash Storage Supported | 512 GB |
Operating System | HP ThinPro |
Graphics Processor | Integrated AMD Radeon Vega 3 |
Power Device Type | External Power Adapter |
Input Voltage | 100-240 VAC |
Power Consumption (Typical) | ≤ 65 W |
Weight | 1.18 kg |
HP SBUY t640 Thin Client, AMD R1505G, 8GB RAM, 32GB Flash



Key Benefits

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- Optimized for VDI and secure cloud environments with HP ThinPro OS and AMD Ryzen performance
- Scalable hardware supports up to 32 GB RAM and 512 GB flash for future-proofing
- TAA compliance ensures suitability for government and regulated sectors
Product Overview
The HP SBUY t640 Thin Client delivers compelling performance for virtual desktop environments with an AMD Ryzen Embedded R1505G CPU clocked at 2.4 GHz and paired with 8 GB DDR4 RAM and 32 GB flash storage. It runs HP ThinPro OS, ideal for secure and manageable enterprise contexts. Comprehensive connectivity includes USB 3.1 Gen 1/2, DisplayPort 1.2, Gigabit Ethernet, Wi-Fi, and Bluetooth 5.0, enhancing compatibility with diverse infrastructure. With TAA compliance and expandable memory up to 32 GB RAM and 512 GB flash, the t640 offers scalability and long-term ROI for cloud-ready deployments.
Specifications
Product Overview
Wireless Features
Wi-Fi Standard | 802.11ac |
Bluetooth Version | 5.0 |
Wireless Antennas | Dual internal antennas |
Wi-Fi Frequency Band | 2.4 GHz and 5 GHz dual-band |
Compliance & Origin
Country of Origin | Mexico |
TAA Compliant | Yes |
Energy Star Certified | Yes |
EPEAT Rating | EPEAT Gold |
RoHS Compliance | Yes |
FCC Certification | Yes |
UL Certification | Yes |
Advanced Security Features
Secure Boot | Yes |
Trusted Platform Module (TPM) | Firmware TPM 2.0 |
Write Filter | Enabled on ThinPro |
User Access Control | HP Sure Admin, OS-level policy control |
Encryption Support | AES Encryption Supported at OS level |
Interfaces
USB 3.1 Gen 1 Type-A Ports | 2 |
USB 3.1 Gen 2 Type-A Ports | 2 |
USB 3.1 Gen 2 Type-C Ports | 1 |
USB 2.0 Type-A Ports | 2 |
DisplayPort 1.2 Ports | 2 |
RJ-45 (Gigabit Ethernet) | 1 |
Combo Audio Jack (3.5 mm) | 1 |
Audio-out (3.5 mm) | 1 |
Physical & Environmental
Dimensions (W x D x H) | 35 x 210 x 200 mm |
Operating Temperature Range | 10°C to 40°C |
Storage Temperature Range | -30°C to 60°C |
Operating Humidity Range | 10% to 90% (non-condensing) |
Mounting Options | VESA mount support |
Cooling | Fanless design |
Cloud Management & Licensing
Management Interface | HP Device Manager, HP Cloud Endpoint Manager |
Licensing Requirements | HP ThinPro OS license included |
Remote Management Capabilities | Yes (centralized management) |