Products Memory, Storage and Components HPE 256GB 8Rx4 PC4-3200AA-L...

HPE 256GB 8Rx4 PC4-3200AA-L DDR4 UDIMM 3DS Kit

VENDOR: HP Mfg Part#: P56435-B21 UPC#: 190017641676
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$33,588.00
$33,588.00
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  • 256 GB DDR4 UDIMM with 8Rx4 configuration for high memory density
  • Operates at 3200 MHz for fast data transfer rates
  • Low 1.2V power requirement for energy-efficient performance
  • Uses 3DS technology for high-density and scalable memory architecture
  • TAA-compliant and manufactured in the United States
  • High reliability verified by manufacturer-provided specifications

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Key Benefits

Eye-Insights
  • Delivers exceptional performance with 256 GB capacity and 3200 MHz speed for enterprise workloads
  • Meets compliance requirements with TAA certification and U.S. origin—ideal for regulated environments
  • Reduces operational costs through 1.2V low-power consumption and 3DS stacking efficiency

Product Overview

The HPE 256GB 8Rx4 PC4-3200AA-L 3DS Kit is designed for high-performance enterprise computing environments. This DDR4 UDIMM module runs at 3200 MHz and supports an 8Rx4 configuration for enhanced density. Its 256 GB capacity is ideal for memory-intensive tasks, while 1.2V low-voltage operation improves energy efficiency. Featuring 3DS stacking technology and TAA compliance, this U.S.-origin module offers excellent reliability and is suitable for government-regulated deployments.

Specifications

Product Overview
Product Type System Memory Module
Memory Capacity 256 GB
Memory Technology DDR4 SDRAM
Memory Speed 3200 MHz
Form Factor UDIMM
Rank 8Rx4
Module Configuration 3DS (Three-Dimensional Stacking)
Voltage 1.2 V
Error Correction ECC (Error-Correcting Code)
Compatibility HP Enterprise Servers and Workstations
Application High-Performance Computing, Data Center

Wireless Features

Compliance & Origin
Country of Origin United States
TAA Compliant Yes
RoHS Compliant Yes
Certifications JEDEC Standard Compliance
Manufacturer Part Number P56435-B21
UPC 190017641676

Advanced Security Features

Interfaces
Interface Type 288-pin DIMM
Bus Type PC4-3200AA
Memory Buffer Type Unbuffered
Data Transfer Rate 25.6 GB/s

Physical & Environmental
Width 7.8 in
Height 3.5 in
Depth 0.75 in
Module Surface Material Standard PCB with Heat-Conduction Layer
Operating Temperature Range 0°C to 85°C
Storage Temperature Range -55°C to 100°C
Relative Humidity (Operating) 10% to 90% non-condensing
Cooling Requirements Standard Airflow

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