Product Type | Air Duct Kit |
Compatible System | Lenovo ThinkSystem SR630 |
Purpose | Optimizes internal airflow and thermal management |
Part Number | 4M17A61348 |
Form Factor | Custom-fit internal accessory |
Weight | 0.5 lbs (approximate) |
Power Requirements | Not required (passive component) |
Lenovo SR630 Air Duct Kit v2, System Accessory





Key Benefits

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- Optimizes airflow to reduce thermal stress on SR630 server components
- Enhances cooling performance without requiring additional external systems
- Genuine Lenovo part ensures compatibility and reliability in enterprise deployments
Product Overview
The Lenovo SR630 Air Duct Kit v2 is a purpose-built accessory engineered for Lenovo ThinkSystem SR630 servers. It assists in directing airflow through critical internal components, helping to sustain stable operating temperatures during intensive data processing tasks. Air ducts like this are vital for systems that operate continuously or under load, contributing to greater longevity and reliability.
This air duct kit is a genuine Lenovo accessory that maintains system integrity by ensuring that air moves efficiently across processors and memory slots where thermal buildup is most common. Valuable in enterprise data centers and server rooms, it helps prevent overheating and supports effective thermal performance, potentially extending the hardware's service life.
While further technical specifications such as compliance standards and country of origin have not been provided, this kit is a recommended solution for organizations seeking to improve server cooling performance without altering the infrastructure or layout.
Specifications
Product Overview
Wireless Features
Wi-Fi Support | |
Antenna Configuration |
Compliance & Origin
Country of Origin | Inquire |
TAA Compliance | Inquire |
RoHS Compliance | Yes |
REACH Compliance | Yes |
WEEE Compliance | Yes |
Manufacturer | Lenovo |
Product Family | System Accessories |
UPC | Inquire |
Advanced Security Features
Embedded Security | Not applicable |
Tamper Resistance | Not applicable |
Tool-less Installation | Yes, designed for easy assembly |
Security Role | Passive airflow management to prevent overheating risk |
Interfaces
Connectivity | None (mechanical installation only) |
Integrated Ports | None |
Physical & Environmental
Dimensions (W x D x H) | 197 mm x 111 mm x 41 mm (approximate) |
Material | High-grade plastic/acrylic polymer |
Color | Black |
Thermal Role | Directs air across CPUs and memory modules |
Installation Location | Internal chassis (above CPU and DIMM area) |
Operating Temperature | 10°C to 35°C (50°F to 95°F) |
Non-Operating Temperature | -40°C to 60°C (-40°F to 140°F) |
Operating Humidity | 8% to 80% (non-condensing) |
Storage Humidity | 5% to 90% (non-condensing) |
Cloud Management & Licensing
Remote Management Support | Not applicable |
Cloud License Model | Not required |
Localization Support | Not applicable |