Product Type | Slot Filler Kit |
Compatibility | Lenovo ThinkEdge SE455 V3 Edge Server |
Purpose | Fills unused PCIe and OCP slots to maintain optimal airflow and cooling |
Form Factor | Custom fit for server PCIe and OCP slots |
Weight | Approximately 0.1 kg (per filler, estimated) |
Power Requirements | None (passive accessory) |
Material | High-grade plastic or metal composite (typical for slot fillers) |
Part Number | 4XF7A93032 |
Lenovo ThinkEdge SE455 V3 PCIe and OCP Slot Filler Kit



Key Benefits

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- Ensures efficient airflow by sealing empty expansion slots in the SE455 V3 chassis
- Supports thermal performance and hardware longevity in edge server deployments
- Complies with TAA requirements, ideal for public sector or regulated industry use
Product Overview
The Lenovo ThinkEdge SE455 V3 PCIe and OCP Slot Filler Kit is an essential accessory for maximizing the reliability and operational efficiency of compatible ThinkEdge SE455 V3 edge servers. Designed specifically to fill vacant PCIe and OCP slots, this kit aids in maintaining optimal cooling pathways and airflow distribution, which is critical in high-performance edge computing environments where thermal stability is key.
Manufactured in Mexico and compliant with TAA (Trade Agreements Act), this kit also supports regulatory and contractual standards required by various government and enterprise installations. By filling unused slots, the accessory helps reduce the build-up of dust and debris while preserving the structural integrity of internal components. This contributes to the long-term reliability and serviceability of Lenovo’s robust edge computing solutions.
Ideal for integrators and IT administrators looking to prolong hardware life and maintain compliance, the filler kit is a straightforward and effective tool to enhance the performance and cleanliness of server deployments.
Specifications
Product Overview
Physical & Environmental
Dimensions | Custom-fitted; dimensions vary per slot type |
Installation Method | Tool-less or screw-based, depending on slot type |
Operating Temperature Range | 10°C to 35°C (aligned with server operating range) |
Non-Operating Temperature Range | -40°C to 70°C |
Storage Humidity | 8% to 90% (non-condensing) |
Operating Humidity | 10% to 85% (non-condensing) |
Dust Protection | Helps limit dust accumulation in open slots |
Color | Black or metallic (variant-dependent) |
Cloud Management & Licensing
Management Interface | Not applicable |
License Requirement | No license required |
Bundled Software | None |
Packaging & Installation
Included Components | PCIe fillers, OCP fillers, installation guide |
Packaging Type | OEM static-free blister or anti-static bag |
Installation Complexity | Low – user-serviceable |
Tools Required | None or basic screwdriver (slot-dependent) |
Interfaces
Supported Slot Types | PCIe and OCP |
Number of Fillers | Multiple pieces for PCIe and OCP slots (exact count may vary by kit) |
Compliance & Origin
Country of Origin | Mexico |
TAA Compliant | Yes |
RoHS Compliant | Yes |
REACH Compliant | Yes |
WEEE Directive | Yes |
Certifications | Lenovo Manufacturing Quality Certified |
Advanced Security Features
Physical Security Benefit | Limits accessibility to internal slots, reducing tampering risk |
Server Protection Feature | Supports maintenance of internal air pressure and cooling integrity |
Tamper Evident Design | No |