Processor Type | AMD EPYC |
Model Number | 7262 |
Number of Cores | 8 |
Number of Threads | 16 |
Base Clock Frequency | 3.2 GHz |
Max Turbo Frequency | 3.4 GHz |
L3 Cache Size | 128 MB |
Architecture | Zen 2 |
Manufacturing Process | 7nm FinFET |
Platform Compatibility | Server |
Thermal Design Power (TDP) | 155 W |
Form Factor | Socketed (SP3) |
AMD EPYC 7262 8-Core 3.2GHz Processor, SP3 Socket, 128MB Cache





Key Benefits

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- Ideal for virtualized workloads and multi-threaded applications due to 8-core/16-thread design
- High 128MB L3 cache optimizes data throughput in demanding environments
- Socket SP3 support enables compatibility with modern server motherboards
Product Overview
The AMD EPYC 7262 processor offers enterprise-class capabilities in a compact 8-core, 16-thread architecture. Designed for Socket SP3 infrastructure, this processor delivers a base clock speed of 3.2 GHz and supports a maximum turbo boost frequency of 3.4 GHz, providing efficient computational power for multitasking, virtualization, and server workloads. With a generous 128MB of L3 cache, it delivers fast data access and reduced bottlenecks to enhance performance across business-critical applications.
Engineered with a 155W thermal design power (TDP), the EPYC 7262 balances its power consumption while offering robust performance. Integrated with AMD's notable EPYC architecture, it is a reliable option for scalable server deployments in data centers or on-premise infrastructures. This processor benefits users looking for an affordable yet capable processor in environments requiring moderate to high parallel compute throughput.
Whether used in entry-level to mid-tier server configurations, the AMD EPYC 7262 offers a solid return on investment through its multi-core capabilities and efficient energy usage. While country of origin and TAA compliance information require inquiry, the core processor attributes make this a dependable foundation for business-scale computing.
Specifications
Product Overview
Physical & Environmental
Package Type | Socket SP3 (LGA4094) |
Die Size | Approx. 192 mm² per chiplet |
Number of Die Chiplets | 1 x CCD, 1 x IOD |
Max Operating Temperature (Tjunction) | 95°C |
Integrated Heat Spreader | Yes |
Cloud Management & Licensing
Virtualization Support | Yes—AMD-V |
Secure Encrypted Virtualization (SEV) | Yes |
Cloud-Scale Deployment Ready | Yes |
License Type | OEM / Tray or PIB depending on distribution |
Interfaces
Socket Type | Socket SP3 |
PCI Express Version | PCIe 4.0 |
PCI Express Lanes | 128 |
Memory Interface | 8-channel DDR4 |
Supported Memory Speed | Up to 3200 MHz |
Supported Memory Type | DDR4 RDIMM/LRDIMM |
Memory Bandwidth | Up to 204.8 GB/s |
Compliance & Origin
Country of Origin | |
TAA Compliant | |
RoHS Compliant | Yes |
Halogen Free | Yes |
ECC Memory Support | Yes |
Advanced Security Features
AMD Secure Processor | Yes |
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
Hardware Root of Trust | Yes |