Processor Type | AMD EPYC |
Model | EPYC 7452 |
Manufacturer | AMD |
Processor Architecture | x86-64 (Zen 2) |
Number of Cores | 32 |
Number of Threads | 64 |
Base Clock Speed | 2.35 GHz |
Max Boost Clock | 3.35 GHz |
Socket Type | Socket SP3 |
Thermal Design Power (TDP) | 155 W |
Generation | 2nd Gen EPYC (Rome) |
Lithography | 7nm FinFET |
Form Factor | Server processor |
Integrated Graphics | No |
AMD EPYC 7452 32-Core 2.35GHz Server Processor





Key Benefits

AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- Delivers exceptional multi-threaded performance with 32 cores and 64 threads, ideal for virtualization and large-scale compute tasks
- High memory bandwidth support via 8-channel DRAM enables superior throughput for enterprise applications
- Efficient power consumption at 155W TDP makes it suitable for scalable, high-density environments
Product Overview
The AMD EPYC 7452 is a powerful 32-core server-class processor built on AMD’s advanced EPYC architecture. Running at a base clock speed of 2.35 GHz and reaching up to 3.35 GHz with Max Turbo frequency, it provides exceptional multi-threaded processing with 64 threads. Designed for the Socket SP3 platform, this processor offers a high-performance solution optimized for demanding data center and virtualization workloads.
Featuring 128 MB of L3 cache and an 8-channel memory interface supporting DRAM, the EPYC 7452 delivers massive memory bandwidth for faster data access and processing. With a 155W TDP, it achieves an effective balance of compute performance and power efficiency, making it well-suited for enterprise-scale environments. The lack of integrated graphics further emphasizes its role in headless server deployments where graphical output is not required.
Ideal for companies building scalable infrastructure, the AMD EPYC 7452 offers the expandability and processing density required for cloud computing, HPC clusters, and virtualization. The absence of TAA compliance may impact some public sector use cases, but its global manufacturing footprint ensures broad availability.
Specifications
Product Overview
Physical & Environmental
Package Type | Package SP3 |
Processor Stepping | B1 |
Max Operating Temperature (TjMax) | 90°C |
Thermal Monitoring Technologies | Yes |
Cloud Management & Licensing
Platform Capabilities | Secure Encrypted Virtualization (SEV), Secure Memory Encryption (SME) |
Virtualization Support | AMD-V |
Cache Memory
L1 Cache | 32 KB per core |
L2 Cache | 512 KB per core |
L3 Cache | 128 MB shared |
Interfaces
PCI Express Version | PCIe 4.0 |
PCIe Lanes | 128 |
Memory Interface | 8-channel DDR4 |
Max Memory Speed | DDR4-3200 |
Memory Bandwidth | 204.8 GB/s |
Compliance & Origin
Country of Origin | Malaysia / China / Taiwan / South Korea |
TAA Compliant | No |
RoHS Compliant | Yes |
Environmental Standards | ENERGY STAR (dependent on system) |
Advanced Security Features
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
AMD Infinity Guard | Yes |
Hardware Root of Trust | Yes |