Processor Type | AMD EPYC 7763 |
Processor Series | EPYC 7003 Series (Milan) |
Processor Socket | Socket SP3 |
Base Clock Speed | 2.45 GHz |
Max Turbo Frequency | 3.5 GHz |
Number of Cores | 64 |
Number of Threads | 128 |
Thermal Design Power (TDP) | 280 Watts |
Manufacturing Technology | 7nm FinFET |
Architecture | Zen 3 |
Form Factor | Server CPU |
AMD EPYC 7763 64-Core Processor, 2.45 GHz, Socket SP3





Key Benefits

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- Ideal for virtualization and parallel workloads due to 64-core/128-thread architecture
- High memory throughput enabled by 8-channel DRAM support and 256 MB L3 cache
- Boosts performance scalability in data centers and HPC environments with up to 3.5 GHz turbo frequency
Product Overview
The AMD EPYC 7763 is a member of the Milan (EPYC 7003 series) server processor family, purpose-built for compute-intensive enterprise environments. With 64 cores and support for 128 threads, it is optimized for high-throughput parallel workloads such as virtualization, data analytics, and large-scale simulations. The processor operates at a base frequency of 2.45 GHz and can turbo boost up to 3.5 GHz for peak performance bursts.
Equipped with a massive 256 MB of L3 cache and using the Socket SP3 platform, the EPYC 7763 also supports 8-channel DRAM memory configurations for high memory bandwidth—ideal for memory-bound applications. It boasts a thermal design power (TDP) rating of 280 watts, appropriate for dense rack servers and workloads that push processing limits. Despite its processing power, the part does not feature TAA compliance, which may be relevant for government or compliance-sensitive installations.
This processor brings strong ROI in enterprise setups, offering an unmatched combination of core density, memory bandwidth, and scalability. Designed for mission-critical systems, it allows IT infrastructure to scale workloads efficiently, enhancing both performance and operational agility in virtualized and data-heavy computing tasks.
Specifications
Product Overview
Physical & Environmental
Package Type | Organic Land Grid Array |
Die Size | Not disclosed |
Operating Temperature (Maximum) | 95° C (Tcase) |
Operating Temperature (Typical) | 85° C (Tcase) |
Cooling Solution Included | No |
Heatsink Compatibility | 3rd Gen EPYC SP3-compatible heatsinks |
Cloud Management & Licensing
vPro / Remote Management | Not supported |
Integrated Security Processor | AMD Infinity Guard |
Secure Boot | Yes |
Secure Memory Encryption (SME) | Yes |
Secure Encrypted Virtualization (SEV) | Yes |
Included Software | None |
Interfaces
Socket Type | SP3 |
PCIe Version | PCIe 4.0 |
PCIe Lanes Supported | 128 |
Memory Interface | 8-Channel DDR4 |
Memory Speed Support | Up to 3200 MHz |
Memory Type | DDR4 Registered ECC |
Max Memory Bandwidth | 204.8 GB/s |
Compliance & Origin
Country of Origin | Malaysia |
TAA Compliant | No |
RoHS Compliance | Yes |
ECC Memory Support | Yes |
Advanced Security Features
Hardware Root of Trust | Yes |
Memory Protection | Secure Memory Encryption (SME) |
Application Isolation | Secure Nested Paging (SNP) |
Side Channel Attack Mitigations | Yes |
Integrated Security | AMD Infinity Guard with SEV-ES and SEV-SNP |