Type | DDR4 ECC Unbuffered DIMM |
Form Factor | UDIMM |
Capacity | 16 GB |
Memory Speed | 3200 MHz |
CAS Latency | CL22 |
Rank | 2Rx8 |
Chip Organization | 8-bit |
Error Checking | ECC (Error-Correcting Code) |
Buffered/Registered | Unbuffered |
Module Type | DIMM |
Voltage | 1.2 V |
Compatibility | Workstations, Entry-level Servers, Industrial Systems |
Kingston 16GB 3200MHz DDR4 ECC CL22 DIMM 2Rx8 Micron R



Key Benefits

AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- ECC support ensures data integrity in critical enterprise and server applications
- TAA compliance and Taiwan origin meet U.S. government and institutional sourcing requirements
- 3200MHz frequency delivers reliable performance for high-bandwidth workloads
Product Overview
The Kingston 16GB 3200MHz DDR4 ECC CL22 DIMM 2Rx8 Micron R (KSM32ED8/16MR) is engineered for systems requiring reliable and stable memory performance. Featuring Error-Correcting Code (ECC) support, this module actively detects and corrects common memory errors, making it suitable for data-intensive applications where accuracy is paramount. With a memory speed of 3200MHz and a latency timing of CL22, it balances responsive performance and energy efficiency.
Its 2Rx8 configuration suggests a dual-rank module built with 8-bit components, ideal for systems designed to benefit from increased memory efficiency at high frequencies. As a TAA-compliant product, it is suitable for use by U.S. government agencies and organizations adhering to trade agreement regulations, further supported by its Taiwanese origin.
Ideal for use in workstations, servers, or industrial computing environments, this memory module from Kingston ensures long-term operational stability. Whether upgrading existing systems or building new infrastructure, it contributes to reduced downtime and improved computational accuracy across demanding workloads.
Specifications
Product Overview
Physical & Environmental
Heatsink | No |
Height | 1.23 inches (31.25 mm) |
Operating Temperature | 0°C to 85°C |
Storage Temperature | -55°C to 100°C |
PCB Layers | 8-layer PCB |
Component Technology | Micron DRAM Chips |
Cloud Management & Licensing
Management Interface | |
Licensing Required | |
Cloud Management Capabilities |
Wireless Features
Wi-Fi | |
Bluetooth | |
Wireless Antennas | |
Frequency Bands |
Interfaces
Interface Type | DDR4 SDRAM |
Memory Bus | 64-bit |
Pins | 288-pin |
Data Transfer Rate | 25.6 GB/s |
Compliance & Origin
Country of Origin | Taiwan |
TAA Compliance | Yes |
RoHS Compliant | Yes |
JEDEC Compliant | Yes |
REACH Compliant | Yes |
Halogen Free | Yes |
Advanced Security Features
On-die ECC | Yes |
Security Features | Memory error detection and correction |