Kingston 16GB DDR4 3200MHz ECC SODIMM CL22 Micron F

VENDOR: KINGSTON Mfg Part#: KSM32SES8/16MF UPC#: 740617328394
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Regular price $64.16
Regular price Sale price $64.16
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MSRP: $96.00
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  • 16GB capacity DDR4 SO-DIMM with 260-pin form factor
  • 3200 MHz (PC4-25600) speed with CL22 latency
  • ECC (Error-Correcting Code) for advanced data integrity
  • Micron F-Die chips, single rank, and eight-bank architecture
  • 1.2V operation for energy-efficient performance
  • JEDEC compliant and TAA compliant with limited lifetime warranty

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Key Benefits

Eye-Insights
  • Ideal for server and workstation environments requiring error-correction via ECC
  • Micron F-Die chips and JEDEC compliance ensure stability in professional applications
  • Backed by a limited lifetime warranty for long-term investment protection

Product Overview

The Kingston 16GB DDR4 3200MT/s ECC SO-DIMM (KSM32SES8/16MF) is engineered for server-grade deployments, offering enhanced performance and reliability. With a speed of 3200MHz and PC4-25600 bandwidth, it ensures fast data processing suited for enterprise computing and data-centric applications. Featuring ECC support, this module adds an extra layer of data integrity, reducing downtime from memory errors—critical for high-uptime environments.

Built with Micron F-Die chips and a single-rank architecture, this SO-DIMM memory leverages a 260-pin unbuffered design. Its low 1.2V power draw supports energy-efficient operation, and JEDEC compliance guarantees dependable compatibility. The CL22 timing ensures a good balance of latency and throughput, while TAA compliance makes it suitable for federal procurement. A limited lifetime warranty assures sustained operational value over time.

Specifications

Product Overview

Manufacturer Kingston
Manufacturer Part Number KSM32SES8/16MF
Product Name Kingston 16GB DDR4 3200MHz ECC SODIMM CL22 Micron F
Product Type Memory Module
Memory Capacity 16 GB
Memory Technology DDR4 SDRAM
Form Factor SO-DIMM 260-pin
Module Configuration 1Rx8 (Single Rank x8)
Die Type Micron F-Die
Data Integrity Check ECC (Error-Correcting Code)
Buffered/Unbuffered Unbuffered
Memory Chip Organization X16
Memory Features Single rank, eight banks, Micron F-Die chips, unbuffered
Bandwidth PC4-25600
CAS Latency CL22
Voltage 1.2 V
Upgrade Type Generic

Physical & Environmental

Dimensions (approximate) 69.6 mm x 30 mm
Operating Temperature Range 0°C to 85°C
Storage Temperature Range -55°C to 100°C
Humidity (non-condensing) 10% to 95%
Weight Approx. 10g

Cloud Management & Licensing

Software Management Interface
Licensing Requirements
Included Cloud Features

Interfaces

Interface Type DDR4
Pin Count 260-pin
Module Speed 3200 MHz
Data Transfer Rate 3200 MT/s
JEDEC Standard Yes

Compliance & Origin

Country of Origin Taiwan
TAA Compliant Yes
Compliance Standards JEDEC
Certifications RoHS, REACH
UPC 740617328394

Advanced Security Features

Hardware-level Encryption
Secure Boot Support
Memory Protection Technologies
Tamper Monitoring