| Manufacturer | Kingston |
| Manufacturer Part Number | KSM32SES8/16MF |
| Product Name | Kingston 16GB DDR4 3200MHz ECC SODIMM CL22 Micron F |
| Product Type | Memory Module |
| Memory Capacity | 16 GB |
| Memory Technology | DDR4 SDRAM |
| Form Factor | SO-DIMM 260-pin |
| Module Configuration | 1Rx8 (Single Rank x8) |
| Die Type | Micron F-Die |
| Data Integrity Check | ECC (Error-Correcting Code) |
| Buffered/Unbuffered | Unbuffered |
| Memory Chip Organization | X16 |
| Memory Features | Single rank, eight banks, Micron F-Die chips, unbuffered |
| Bandwidth | PC4-25600 |
| CAS Latency | CL22 |
| Voltage | 1.2 V |
| Upgrade Type | Generic |
Kingston 16GB DDR4 3200MHz ECC SODIMM CL22 Micron F

Key Benefits
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- Ideal for server and workstation environments requiring error-correction via ECC
- Micron F-Die chips and JEDEC compliance ensure stability in professional applications
- Backed by a limited lifetime warranty for long-term investment protection
Product Overview
The Kingston 16GB DDR4 3200MT/s ECC SO-DIMM (KSM32SES8/16MF) is engineered for server-grade deployments, offering enhanced performance and reliability. With a speed of 3200MHz and PC4-25600 bandwidth, it ensures fast data processing suited for enterprise computing and data-centric applications. Featuring ECC support, this module adds an extra layer of data integrity, reducing downtime from memory errors—critical for high-uptime environments.
Built with Micron F-Die chips and a single-rank architecture, this SO-DIMM memory leverages a 260-pin unbuffered design. Its low 1.2V power draw supports energy-efficient operation, and JEDEC compliance guarantees dependable compatibility. The CL22 timing ensures a good balance of latency and throughput, while TAA compliance makes it suitable for federal procurement. A limited lifetime warranty assures sustained operational value over time.
Specifications
Product Overview
Physical & Environmental
| Dimensions (approximate) | 69.6 mm x 30 mm |
| Operating Temperature Range | 0°C to 85°C |
| Storage Temperature Range | -55°C to 100°C |
| Humidity (non-condensing) | 10% to 95% |
| Weight | Approx. 10g |
Cloud Management & Licensing
| Software Management Interface | |
| Licensing Requirements | |
| Included Cloud Features |
Interfaces
| Interface Type | DDR4 |
| Pin Count | 260-pin |
| Module Speed | 3200 MHz |
| Data Transfer Rate | 3200 MT/s |
| JEDEC Standard | Yes |
Compliance & Origin
| Country of Origin | Taiwan |
| TAA Compliant | Yes |
| Compliance Standards | JEDEC |
| Certifications | RoHS, REACH |
| UPC | 740617328394 |
Advanced Security Features
| Hardware-level Encryption | |
| Secure Boot Support | |
| Memory Protection Technologies | |
| Tamper Monitoring |