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Lenovo SN550 V2 Platinum Xeon 8352M 32C 2.3GHz 185W CPU

VENDOR: LENOVO Mfg Part#: 4XG7A63657
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$8,789.00
$8,789.00
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  • 32-core Intel Xeon 8352M processor for high-parallel workloads
  • Base clock speed of 2.3GHz with max turbo frequency of 3.5GHz
  • 48MB of cache memory for optimized data access
  • 10nm lithography for improved performance-per-watt
  • 185W Thermal Design Power (TDP) for balanced energy efficiency
  • FCLGA4189 socket compatibility for scalable deployment

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Key Benefits

Eye-Insights
  • Offers exceptional performance for virtualized and multi-threaded environments with its 32-core architecture.
  • Reduces latency and boosts data access speeds due to its 48MB cache and 3.5GHz turbo frequency.
  • Compatible with scalable server infrastructures using the FCLGA4189 socket and 10nm lithography efficiency.

Product Overview

The Lenovo SN550 V2 Platinum, equipped with the Intel Xeon 8352M processor, is a high-performance server-grade CPU tailored for intensive data center and computing workloads. Built on advanced 10nm process lithography, it features 32 cores and operates at a base clock speed of 2.3GHz, scaling up to 3.5GHz with Intel Turbo Boost Technology. This configuration makes it well-suited for virtualization, AI inference, and big data processing.

With a Thermal Design Power (TDP) of 185W, the Xeon 8352M balances performance with power efficiency. A substantial 48MB cache accelerates data access, enhancing performance in multi-threaded environments. The FCLGA4189 socket ensures compatibility with scalable Intel server platforms. Although certain administrative attributes like COO and TAA compliance are not disclosed, the processor’s technical profile makes it ideal for critical enterprise deployments.

Specifications

Product Overview
Product Type Server Processor
Processor Series Intel Xeon Platinum 8352M
Number of Cores 32
Number of Threads 64
Base Clock Speed 2.3 GHz
Max Turbo Frequency 3.5 GHz
Processor Socket FCLGA4189
Thermal Design Power (TDP) 185 W
L3 Cache 48 MB
Lithography 10 nm
Form Factor Processor Module
CPU Package Size 77.5mm x 56.5mm
Generation 3rd Gen Intel Xeon Scalable

Memory Support
Memory Types Supported DDR4-3200
Maximum Memory Bandwidth 204.8 GB/s
Memory Channels 8
Max Memory Size 6 TB
ECC Support Yes

Physical & Environmental
Package Size 77.5mm x 56.5mm
Operating Temperature Range 5°C to 85°C

Cloud Management & Licensing
Cloud-ready Processor Features Optimized for virtualization and cloud-native workloads

Interfaces
PCI Express Version 4.0
PCI Express Lanes 64
Socket Supported FCLGA4189
Processor Connectivity Interface UPI (Ultra Path Interconnect) 11.2 GT/s
Number of UPI Links 3

Advanced Technologies
Intel Turbo Boost Technology 2.0
Intel Hyper-Threading Technology Yes
Intel Speed Select Technology Yes
Intel VT-x (Virtualization Technology) Yes
Intel VT-d Yes
Intel DL Boost Yes
Intel Deep Learning Boost Yes
Intel AES New Instructions Yes
Intel Resource Director Technology Yes
Intel Speed Shift Technology Yes

Compliance & Origin
Country of Origin
TAA Compliance

Advanced Security Features
Secure Boot Support Yes
Intel Boot Guard Yes
Intel AES New Instructions Yes
Intel Trusted Execution Technology Yes
Intel Software Guard Extensions (SGX) Yes