Type | DDR5 SO-DIMM Memory Kit |
Form Factor | SO-DIMM 262-pin |
Installed Modules | 2 x 16GB |
Total Capacity | 32 GB |
Memory Speed | 5600 MT/s |
CAS Latency (CL) | CL40 |
Voltage | 1.1 V |
Plug and Play (PnP) | Yes |
ECC Support | Non-ECC |
Buffered/Registered | Unbuffered |
Module Configuration | 2048M x64 |
Heat Spreader | Yes (Low Profile Design) |
Kingston FURY Impact 32GB DDR5 5600MT/s CL40 SODIMM Kit (2x16GB)



Key Benefits

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- Delivers significant bandwidth improvements over DDR4, ideal for demanding multitasking and data-intensive applications
- Energy-efficient 1.1V operation extends battery life and reduces heat in laptops and compact PCs
- Easy deployment with Plug N Play functionality and broad compatibility for system builders and IT teams
Product Overview
Kingston's FURY Impact 32GB DDR5 memory kit delivers high-end performance for mobile computing platforms requiring compact, high-speed memory solutions. This kit consists of two 16GB SO-DIMM modules, compliant with DDR5 specifications and optimized to operate at a blistering 5600MT/s memory speed. With a CAS latency of CL40 and a supply voltage of just 1.1V, it ensures improved bandwidth and energy efficiency over DDR4, helping maximize notebook and small form factor PC performance.
Built with modern devices in mind, these 262-pin SODIMM modules feature Plug N Play (PnP) capabilities for seamless compatibility with a wide array of laptops and compact systems. Whether you're pushing system limits in gaming, running large datasets, or engaging in advanced creative workflows, this kit supports ultra-fast multitasking with minimal power draw. Its TAA compliance and Taiwan-origin manufacturing marks it as a trusted solution for enterprise and government deployments.
Ideal for machine builders, IT integrators, and performance-focused end users, the Kingston FURY Impact DDR5 SODIMM kit offers a compelling combination of speed, capacity, and operational stability. Upgrade with confidence and stay ahead of demanding computing workloads.
Specifications
Product Overview
Physical & Environmental
Dimensions (Per Module) | 69.6 mm x 30 mm |
Operating Temperature | 0°C to 85°C |
Storage Temperature | -55°C to 100°C |
Operating Humidity | 10% to 90% RH (non-condensing) |
Storage Humidity | 5% to 95% RH (non-condensing) |
Weight | Approx. 20 g (total kit) |
Cloud Management & Licensing
Software/Driver Requirement | No additional software required |
Interfaces
Interface Type | DDR5 SDRAM |
Memory Pins | 262-pin |
SPD Profile | Yes |
XMP Support | Intel XMP 3.0 Ready |
Compliance & Origin
TAA Compliant | Yes |
Country of Origin | Taiwan |
RoHS Compliant | Yes |
REACH Compliant | Yes |
Halogen Free | Yes |
CE Certification | Yes |
FCC Certification | Yes |
Advanced Security Features
On-Die ECC | Yes (internal error correction for data integrity) |
Power Management IC (PMIC) | Integrated |
Security Features | DDR5 internal safeguarding features |