Product Type | Workstation/Server Graphics Card |
GPU Chipset | AMD FirePro S7150 |
Form Factor | Dual-slot, full-height |
Cooling Type | Passive (Reverse Flow Design) |
Memory Capacity | 16 GB GDDR5 (8 GB per GPU) |
Number of GPUs | 2 |
Bus Type | PCI Express 3.0 x16 |
TDP (Thermal Design Power) | 265 Watts |
Power Connectors | 2 x 6-pin PCIe |
Virtualization Technology | AMD MxGPU (Multiuser GPU) Technology |
AMD FirePro S7150x2 16GB Passive Reverse Flow Graphics Card



Key Benefits

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- - Designed specifically for enterprise virtualization, enabling multiple users to share GPU resources efficiently
- - Reverse flow passive cooling supports integration into non-standard server airflow configurations
- - High-performance 16GB memory ensures smooth operation for demanding professional workloads
Product Overview
The AMD FirePro S7150x2 16GB Passive Reverse Flow graphics card is engineered for enterprise virtualization environments, supporting multi-user GPU access through AMD’s advanced MxGPU technology. It features a passive reverse thermal design ideal for reverse airflow server enclosures, and includes 16GB of dedicated memory to handle demanding workloads. Built upon the AMD FirePro S7150 chipset, this solution is optimized for longevity and thermal efficiency in datacenter and professional IT environments.
Specifications
Product Overview
Cloud Management & Licensing
GPU Virtualization Support | Yes, SR-IOV via AMD MxGPU |
Supported Virtualization Platforms | VMware ESXi, Citrix XenServer, Microsoft Hyper-V |
Licensing Model | Hardware-based GPU virtualization (No per-user pricing) |
Remote Management Support | Yes, via compatible hypervisor |
Physical & Environmental
Dimensions (L x H) | 11.5 x 4.4 inches (292 x 112 mm) |
Bracket Type | Full-height |
Cooling Configuration | Passive; Reverse Airflow Direction |
Airflow Design | Reverse (designed for rear-to-front airflow servers) |
Operating Temperature Range | 0°C to 45°C |
Non-Operating Temperature Range | -40°C to 75°C |
Humidity (Operating) | 10% to 90% (non-condensing) |
Humidity (Storage) | 5% to 95% (non-condensing) |
Wireless Features
Wi-Fi Support | |
Bluetooth |
Interfaces
Host Interface | PCI Express 3.0 x16 |
External Display Outputs | None (Headless GPU for Virtualization) |
Multi-GPU Support | Yes (Dual GPU on-board) |
Advanced Security Features
Hardware-accelerated Data Isolation | Yes, via GPU partitioning |
User Isolation | Yes, through MxGPU technology |
Secure Boot | Supported on compatible platforms |
Compliance & Origin
TAA Compliance | Inquire |
Country of Origin | Inquire |
Environmental Standards | RoHS Compliant |
Certifications | FCC, CE, C-Tick, BSMI, KCC, VCCI |