| Product Type | Processor heatsink |
| Component Type | CPU Heatsink |
| Compatible Processor Series | Intel Xeon Scalable (3rd Gen) |
| Form Factor | Blade server accessory |
| Weight | Approx. 1.2 lbs (0.54 kg) |
| Mounting Position | Rear CPU socket |
| Power Requirements | Passive cooling component; no direct power required |
Cisco UCSB-HS-M6-R= CPU Heatsink for UCS B-Series M6 (Rear Mount)

Key Benefits
AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- Built specifically for UCS B-Series M6 servers, ensuring a precise mechanical and thermal fit
- TAA compliance enables deployment in government-regulated IT environments
- High-efficiency thermal design enhances CPU longevity and system stability
Product Overview
The Cisco UCSB-HS-M6-R= is a high-performance processor heatsink engineered for the rear CPU socket on UCS B-Series M6 Blade Servers. Designed for use in models like the UCSB-B200-M6-U and various UCSB-5108 chassis configurations, it provides targeted thermal management in high-density computing environments. TAA compliance and origin in CHINA / UNITED STATES make it suitable for regulated deployments. Ideal for ensuring system longevity and performance, it forms part of a critical infrastructure for thermal control in data centers.
Specifications
Product Overview
Physical & Environmental
| Dimensions (W x H x D) | 3.2 x 2.4 x 4.7 in (approx.) |
| Operating Temperature | 10°C to 35°C (50°F to 95°F) |
| Storage Temperature | -40°C to 70°C (-40°F to 158°F) |
| Operating Humidity | 5% to 93% (non-condensing) |
| Heat Dissipation Capacity | Supports high thermal design power (TDP) CPUs |
| Cooling Method | Passive heatsink, chassis-driven airflow |
Compatibility
| Designed For | Cisco UCS B200 M6 Blade Servers |
| Compatible Chassis | Cisco UCS 5108 Series |
| Installation Position | Rear CPU Socket Only |
| Compatible Part Numbers | UCSB-5108-AC2, UCSB-5108-DC2, UCSB-B200-M6-U, etc. |
Advanced Security Features
| Integrated Security | Not applicable |
Interfaces
| Interface Type | Direct-contact thermal interface |
| Base Material | Copper with aluminum-finned heatsink |
| Thermal Interface Material (TIM) | Pre-applied TIM pad |
Compliance & Origin
| Country of Origin | China or United States |
| TAA Compliant | Yes |
| RoHS Compliance | Yes |
| Halogen-Free | Yes |
| REACH Compliant | Yes |
Cloud Management & Licensing
| Management Interface | |
| Licensing Requirements | None (passive accessory) |
| Smart Licensing Support | Not applicable |
Packaging & Materials
| Heatsink Finish | Nickel-plated base |
| Packaging Type | OEM anti-static packaging |
| Included Accessories | Pre-applied thermal compound |
| Heatsink Type | High-density fin stack |