Products Memory, Storage and Components Kingston 16GB DDR4 2666MHz ...

Kingston 16GB DDR4 2666MHz ECC CL19 DIMM (KSM26ES8/16HC)

VENDOR: KINGSTON Mfg Part#: KSM26ES8/16HC UPC#: 740617324860
1 3
Photo is for illustration purposes only. Actual product may be different.
$65.43
$65.43
Sale Sold out
MSRP: $96.00
Shipping calculated at checkout.
  • 16GB DDR4 memory module with ECC for enhanced error correction
  • 2666 MHz memory speed ensures efficient data handling
  • CL19 CAS latency for standard timing performance
  • DIMM form factor suitable for desktops and servers
  • 1Rx8 rank configuration with Hynix chipset for signal integrity
  • TAA compliant and manufactured in Taiwan for procurement compatibility

Shipping & Returns

All our products can be shipped anywhere in the Continental United States.

View our shipping and returns policy

View full details

Key Benefits

Eye-Insights
  • Equipped with ECC functionality, this module reduces data corruption, ideal for enterprise-grade systems.
  • Manufactured to meet TAA compliance standards, ensuring suitability for government and institutional use.
  • Kingston's reputation and Hynix chipset provide trusted compatibility and long-term reliability in IT infrastructure.

Product Overview

The Kingston KSM26ES8/16HC is a 16GB DDR4 ECC memory module designed for high-performance computing in enterprise and workstation setups. With a frequency of 2666MHz and CL19 CAS latency, it supports fast and efficient data transmission. Its ECC technology ensures greater data integrity, making it well-suited for critical applications. Manufactured in Taiwan and TAA compliant, it meets procurement requirements for government and professional sectors. With a 1Rx8 rank structure and a reliable DIMM form factor, this module is ideal for memory-intensive environments demanding system consistency and stability.

Specifications

Product Overview
Type Server Memory Module
Form Factor DIMM
Memory Technology DDR4 SDRAM
Capacity 16 GB
Rank 1Rx8
Module Height Standard
Power Supply Voltage 1.2 V
CAS Latency (CL) CL19
Chip Organization X8
Component Manufacturer Hynix

Physical & Environmental
Heatsink No
Operating Temperature 0°C to 85°C
Storage Temperature -55°C to 100°C
Humidity (non-condensing) 10% to 90%
Dimensions (H x L) 31.25 mm x 133.35 mm
Weight Approx. 20 g

Advanced Security Features
Error Correction ECC (Error Correction Code)

Wireless Features
Wireless Capability

Interfaces
Memory Speed 2666 MHz
Bus Type PC4-21300
Data Transfer Rate 21300 MB/s
Pin Count 288-pin
Interface Type DDR4 SDRAM

Compliance & Origin
TAA Compliant Yes
Country of Origin Taiwan
RoHS Compliant Yes
JEDEC Standard Yes
Halogen Free Yes
REACH Compliant Yes

Cloud Management & Licensing
Remote Management
Cloud Software
Subscription/License Required