Manufacturer | Kingston |
Manufacturer Part Number | KSM26RS4/32MFR |
Product Name | Kingston 32GB DDR4 2666MHz ECC Reg CL19 DIMM 1Rx4 |
Memory Type | DDR4 SDRAM |
Module Capacity | 32 GB |
Data Rate | 2666 MT/s |
Rank | 1Rx4 |
CAS Latency | CL19 |
Register Type | Registered (Buffered) |
Error Correction | ECC (Error-Correcting Code) |
Supply Voltage | 1.2 V |
Module Configuration | 4096M x 72 |
Component Composition | Micron F-grade DRAM chips |
Technology Feature | Bi-Directional Differential Data Strobe |
Kingston 32GB DDR4 2666MHz ECC Reg CL19 DIMM 1Rx4


Key Benefits

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- Optimized for server applications requiring ECC and stable high-speed performance
- TAA-compliant and made with Micron chips, meeting government procurement standards
- Supports data integrity through ECC and advanced signal optimization features
Product Overview
The Kingston KSM26RS4/32MFR is a 32GB DDR4 ECC Registered memory module optimized for reliability and performance in enterprise and server applications. Operating at a data rate of 2666MT/s, it allows for fast memory transfers ideal for virtualization, data processing, and cloud-based workloads. The 1Rx4 rank configuration and CL19 latency provide a balanced profile for high bandwidth and low latency operations in multi-core environments.
Built with a 288-pin DIMM form factor, this module incorporates Bi-Directional Differential Data Strobe technology for improved signal accuracy, reducing data errors and enhancing overall stability. The memory also supports Error-Correcting Code (ECC), making it suitable for applications where data integrity is critical. Manufactured with Micron F-grade components and compliant with TAA standards, it’s tailored for government procurements and enterprise solutions requiring trusted supply chains.
Ideal for system builders and IT professionals upgrading or expanding server memory, the Kingston KSM26RS4/32MFR offers reliable and energy-efficient performance. Its compatibility with DDR4-supported systems ensures scalability and long-term investment value in evolving data center infrastructures.
Specifications
Product Overview
Physical & Environmental
Module Height | 31.25 mm |
Operating Temperature (Minimum) | 0°C |
Operating Temperature (Maximum) | 85°C |
Storage Temperature (Minimum) | -55°C |
Storage Temperature (Maximum) | 100°C |
PCB Layers | 8-layer PCB |
Cloud Management & Licensing
Remote Management Capable | |
Requires Proprietary Licensing |
Interfaces
Form Factor | DIMM |
Pin Count | 288-pin |
Interface Type | DDR4 SDRAM Interface |
Memory Bandwidth | 21.3 GB/s |
Compliance & Origin
TAA Compliant | Yes |
Country of Origin | Taiwan |
RoHS Compliant | Yes |
Halogen Free | Yes |
JEDEC Standard | Compliant |
Advanced Security Features
Security Features | ECC for single-bit error correction and multi-bit error detection |