Type | DDR4 ECC Registered DIMM |
Memory Capacity | 32GB |
Memory Speed | 3200MT/s |
CAS Latency | CL22 |
Rank | 2Rx8 |
DRAM Technology | Micron F DRAM |
Module Configuration | 2Rx8 |
Form Factor | UDIMM (DIMM) |
Buffering | Registered (Buffered) |
Error Correction | ECC |
Voltage | 1.2V |
Pins | 288-pin |
Component Density | x8 |
Power Requirements | Standard DDR4 1.2V |
Heat Spreader | No |
Kingston 32GB DDR4 ECC Reg 3200MT/s CL22 DIMM 2Rx8



Key Benefits

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- ECC Registered design ensures data integrity needed for mission-critical computing.
- TAA compliance qualifies the module for use in government-regulated environments.
- Manufactured by Kingston using Micron F components for trusted enterprise reliability.
Product Overview
The Kingston KSM32RD8/32MFR is a 32GB DDR4 ECC Registered DIMM designed for high-performance enterprise environments. With a data rate of 3200MT/s and CL22 latency, it supports fast memory operations while maintaining data integrity through ECC. Its 2Rx8 configuration and use of Micron F DRAM components reflect quality and compatibility. TAA compliance and manufacturing in Taiwan further affirm its position for use in regulated sectors and mission-critical applications.
Specifications
Product Overview
Physical & Environmental
Module Height | 31.25 mm |
Operating Temperature | 0°C to 85°C |
Storage Temperature | -55°C to 100°C |
Relative Humidity (Operating) | 10% to 90% (non-condensing) |
Relative Humidity (Storage) | 5% to 95% (non-condensing) |
Compatibility
Compatible Systems | Servers and Workstations supporting DDR4 ECC Registered DIMMs |
Intel Platform Support | Intel Xeon Scalable (3rd Gen and compatible) |
AMD Platform Support | AMD EPYC (Rome/Milan series) |
Identification & Packaging
Manufacturer Part Number | KSM32RD8/32MFR |
UPC | 740617328738 |
Interfaces
Memory Interface | DDR4 SDRAM |
Data Transfer Rate | 3200 MT/s |
Compliance & Origin
Compliance Standard | JEDEC |
TAA Compliant | Yes |
RoHS Compliant | Yes |
Country of Origin | Taiwan |
Halogen Free | Yes |
Advanced Features
On-Die Termination | Yes |
PCB Layers | 10-layer PCB for signal integrity |
SPD (Serial Presence Detect) | Yes |
Internal Thermal Sensor | Yes |