Product Type | Server Processor |
Processor Series | Intel Xeon Scalable 3rd Gen |
Processor Model | Xeon 8352M |
Number of Cores | 32 |
Number of Threads | 64 |
Base Clock Speed | 2.3 GHz |
Max Turbo Frequency | 3.5 GHz |
L3 Cache | 48 MB |
Processor Socket | FCLGA4189 |
Lithography | 10 nm |
TDP (Thermal Design Power) | 185 W |
Form Factor | Processor Module |
Compatible Server Platform | Lenovo ThinkSystem SR650 V2 |
Lenovo SR650 V2 Xeon 8352M 32-Core 2.3GHz 185W CPU
Key Benefits

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- Designed for enterprise workloads requiring high core count and processing power
- Balances thermal efficiency and performance with 185W TDP and 10 nm technology
- Ideal upgrade or integration for Lenovo SR650 V2 systems requiring multi-threaded computing
Product Overview
The Lenovo SR650 V2 integrates the Intel Xeon 8352M processor to deliver the high-throughput computing required by enterprise data centers and virtualization tasks. Operating at a base frequency of 2.3 GHz and turbo boosting up to 3.5 GHz, this 32-core server-grade CPU is engineered to handle multi-threaded workloads efficiently. Designed for socket FCLGA4189 and fabricated using a 10 nm lithography process, the processor balances strong performance with energy-conscious design.
The processor's 48MB cache significantly improves access to frequently used data, reducing latency and accelerating workload processing. With a 185W TDP, it is optimized for performance scalability in thermal-constrained environments. This model is ideal for deployment in compute-dense configurations like the Lenovo SR650 V2 server series, designed for demanding workloads including virtualization, AI inference, and in-memory database management.
Overall, the Lenovo SR650 V2 solution with the Xeon 8352M enables enterprises to consolidate applications while maintaining performance and reducing total cost of ownership. Information on country of origin and TAA compliance status is currently unavailable.
Specifications
Product Overview
Physical & Environmental
Thermal Monitoring Technologies | Yes |
Maximum Operating Temperature (Tcase) | 82°C |
Package Size | 77.5mm x 56.5mm |
Heatsink Included | No |
Cloud Management & Licensing
Intel Resource Director Technology | Yes |
Intel Volume Management Device (VMD) | Yes |
Intel Boot Guard | Yes |
Intel Deep Learning Boost Support | Yes |
Intel Speed Select Technology | No |
Intel Trusted Execution Technology (TXT) | Yes |
Intel Run Sure Technology | Yes |
Interfaces
Socket Supported | LGA 4189 |
PCI Express Revision | PCIe 4.0 |
PCI Express Lanes | 64 |
Compliance & Origin
Country of Origin | |
TAA Compliant | |
Compliance Standards | RoHS |
Advanced Security Features
Hardware-Based Security | Intel SGX (Software Guard Extensions) |
Secure Boot | Yes |
AES New Instructions | Yes |
Secure Key | Yes |
OS Guard | Yes |
Mode-Based Execute Control (MBEC) | Yes |