Processor Type | AMD EPYC 7203 |
Processor Family | AMD EPYC-Series |
Form Factor | Server Processor |
Number of Cores | 8 |
Number of Threads | 16 |
Base Clock Speed | 2.8 GHz |
Max Boost Clock | 3.4 GHz |
Thermal Design Power (TDP) | 120 Watt |
L3 Cache | 64 MB |
Socket Type | Socket SP3 |
Memory Channel Supported | 8 |
Memory Bandwidth | Up to 3200 MT/s |
Compatible RAM Type | DDR4 |
Use Case | Data Center, Virtualization, Cloud Computing |
Part Number | 4XG7A90628 |
Lenovo SR665 AMD EPYC 7203 8-Core 2.8GHz 120W Processor



Key Benefits

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- High core and thread count supports efficient multitasking in enterprise applications
- TAA compliance and Mexico origin meet regulatory needs for government and public sector deployments
- Socket SP3 compatibility ensures easy integration with a wide range of AMD EPYC server platforms
Product Overview
The Lenovo SR665 AMD EPYC 7203 processor provides robust computing for server environments. Featuring 8 physical cores and 16 threads, this AMD EPYC processor is designed for workloads that benefit from parallel processing and high throughput. The base clock speed of 2.8 GHz and a max boost frequency of 3.4 GHz enable responsive performance across data-intensive applications. A thermal design power (TDP) of 120 watts ensures a balance between performance and thermal efficiency in demanding setups.
Equipped with 64MB of L3 cache and support for 8-channel DRAM operating at up to 3200MT/s, the EPYC 7203 is engineered for fast memory access and optimal data bandwidth. It uses the Socket SP3 interface, making it compatible with enterprise-grade motherboards that support AMD EPYC processors. Manufactured in Mexico and TAA compliant, it suits organizations requiring serviceable and regulation-adhering hardware, including government deployments.
While additional platform features or technologies were not provided, the processor’s fundamental capabilities render it ideal for virtualized environments, infrastructure hosting, and cloud backbone applications where resource scalability and computational reliability are key. No dynamic security or advanced power management features were listed.
Specifications
Product Overview
Physical & Environmental
Manufacturing Process | 7nm FinFET |
Operating Temperature Range | 10°C to 80°C |
Cooling Requirement | Active or Passive Heatsink (depending on chassis airflow) |
Cloud Management & Licensing
Cloud Support | Designed for Virtualized and Cloud Environments |
Licensing | No licensing required (hardware only) |
Server Platform Compatibility | Lenovo ThinkSystem SR665 and similar SP3 motherboards |
Interfaces
Supported Interfaces | Socket SP3 (LGA4094) |
PCI Express Version | PCIe 4.0 |
PCIe Lanes | Up to 128 |
Compliance & Origin
TAA Compliant | Yes |
Country of Origin | Mexico |
RoHS Compliance | Yes |
Halogen Free | Yes |
REACH Compliant | Yes |
Advanced Security Features
Security Features | Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV) |
Trusted Platform Support | Yes (Requires compatible motherboard TPM) |
Spectre / Meltdown Mitigation | Hardware and microcode-level mitigations included |