| Processor Type | AMD EPYC | 
| Model Number | 7302 | 
| Number of Cores | 16 | 
| Number of Threads | 32 | 
| Base Clock Speed | 3.0 GHz | 
| Max Boost Clock | 3.3 GHz | 
| L3 Cache | 128 MB | 
| Thermal Design Power (TDP) | 155 W | 
| Manufacturing Process | 7 nm | 
| Platform | Server | 
| Product Family | EPYC 7002 Series | 
| Processor Architecture | x86-64 | 
| Instruction Set | 64-bit | 
| Transistor Count | Up to 19.2 billion | 
| Chipset Compatibility | AMD SP3 Platform | 
AMD EPYC 7302 16-Core 3GHz Server Processor
 
 
 
 

Key Benefits
 
            
            
              
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- Delivers 16 powerful cores, ideal for virtualized and parallel computing workloads
- High cache capacity (128 MB) ensures reduced latency and improved throughput
- Energy-efficient design with 155W TDP maximizes performance-per-watt for server deployment
Product Overview
The AMD EPYC 7302 is a 16-core server processor designed for Socket SP3 platforms, delivering 3.0 GHz base and 3.3 GHz turbo performance ideal for virtualization and compute-heavy workloads. It boasts a 128 MB cache and a 155W TDP, balancing power and thermal efficiency for enterprise environments. Part of the EPYC-series, the 7302 provides scalable performance suitable for modern data centers and HPC deployments. Additional compliance and origin data are currently unavailable.
Specifications
                      Product Overview
                      
                    
                    
                      Wireless Features
                      
                    
                    | Integrated Wireless | 
                      Compliance & Origin
                      
                    
                    | Country of Origin | |
| TAA Compliant | |
| RoHS Compliance | Yes | 
| Halogen Free | Yes | 
                      Advanced Security Features
                      
                    
                    | AMD Infinity Guard | Yes | 
| Secure Memory Encryption (SME) | Yes | 
| Secure Encrypted Virtualization (SEV) | Yes | 
| Hardware Root of Trust | Yes | 
                      Interfaces
                      
                    
                    | Socket Type | Socket SP3 | 
| PCI Express Version | PCIe 4.0 | 
| PCIe Lanes Supported | 128 | 
| Memory Interface | 8 channels DDR4 | 
                      Physical & Environmental
                      
                    
                    | Package Type | Organic Land Grid Array (LGA) | 
| Package Dimensions | 76mm x 55mm | 
| Max Operating Temperature | 90°C (Tjmax) | 
| Cooling Solution Included | No | 
| Operating Temperature Range | 10°C to 70°C | 
                      Cloud Management & Licensing
                      
                    
                    | Remote Management Support | Platform dependent via host server BMC/IPMI | 
| License Type | OEM / Tray | 
 
               
     
     
     
    