| Processor Type | AMD EPYC 7502 |
| Processor Family | AMD EPYC 7002 Series (Rome) |
| Number of Cores | 32 |
| Number of Threads | 64 |
| Base Clock Speed | 2.5 GHz |
| Max Boost Clock | 3.35 GHz |
| L3 Cache | 128 MB |
| Thermal Design Power (TDP) | 180 W |
| Manufacturing Technology | 7 nm |
| Processor Socket | Socket SP3 |
| Integrated Graphics | No |
| Architecture | x86-64 |
| Instruction Set Extensions | AVX2, SSE4.2 |
| Platform | Server |
AMD EPYC 7502 32-Core 2.5GHz Server Processor

Key Benefits
AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- Delivers exceptional multi-threaded performance ideal for virtualization and database workloads
- Supports large memory bandwidth with 8-channel DRAM and robust 128MB L3 cache
- Built for modern enterprise reliability with versatile international manufacturing and SP3 socket compatibility
Product Overview
The AMD EPYC 7502 is a high-performance 32-core server processor optimized for compute-intensive enterprise tasks. It offers 64 threads of parallel processing, a base clock speed of 2.5 GHz with a boost up to 3.35 GHz, and a thermal design power (TDP) of 180W. The processor includes 128MB of L3 cache and supports 8 memory channels with DRAM. It uses the Socket SP3 platform and is manufactured in multiple international facilities. While not TAA-compliant, it offers an exceptional return on investment for large-scale workloads like virtualization, cloud computing, and data-intensive tasks.
Specifications
Product Overview
Memory Support
| Memory Types Supported | DDR4-3200 |
| Number of Memory Channels | 8 |
| Max Memory Bandwidth | 204.8 GB/s |
| ECC Memory Support | Yes |
| Max Memory Size | 4 TB |
Compliance & Origin
| Country of Origin | Malaysia / China / Taiwan / South Korea |
| TAA Compliant | No |
| RoHS Compliant | Yes |
| Halogen Free | Yes |
Cloud Management & Licensing
| Licensing Model | Per Socket/Per Core Subscription Model (varies by vendor) |
| Cloud Optimization | Yes (Optimized for Virtualization and Cloud Workloads) |
Interfaces
| PCI Express Version | PCIe 4.0 |
| PCI Express Lanes | 128 |
Physical & Environmental
| Processor Package | Organic Land Grid Array (LGA) |
| Die Size | Estimated 260 mm² (CCD) |
| Operating Temperature (Max) | 95°C |
Advanced Security Features
| Security Features | Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV), Hardware Root of Trust |
| Hardware Virtualization | AMD-V |
| Boot Secure | Yes |
| Trusted Platform Module (TPM) Support | TPM 2.0 (via platform support) |