Processor Type | AMD EPYC |
Model Number | 9374F |
Number of Cores | 32 |
Number of Threads | 64 |
Base Clock Speed | 3.85 GHz |
Max Turbo Frequency | 4.3 GHz |
Socket Type | Socket SP5 |
Thermal Design Power (TDP) | 320 W |
Cache Type | L3 |
L3 Cache Size | 256 MB |
Supported Memory Type | DDR5 |
Memory Channels | 12 |
Native Instruction Set | x86-64 |
Manufacturing Process | 5 nm FinFET |
Architecture | Zen 4 |
Processor Family | AMD EPYC 9004 Series |
Product Type | Server Processor |
Form Factor | FC-LGA 6096 |
AMD EPYC 9374F 32-Core Processor, 3.85GHz, Socket SP5




Key Benefits

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- Optimized for high-performance server workloads thanks to 32 cores and 64 threads
- High-frequency operation (up to 4.3 GHz) ensures fast processing under peak demand
- Supports wide memory bandwidth (12 DRAM channels), ideal for virtualization and HPC tasks
Product Overview
The AMD EPYC 9374F is engineered for performance-focused server platforms requiring unparalleled multi-threading and memory bandwidth. Built on AMD's cutting-edge EPYC architecture, this 32-core, 64-thread processor runs at a base clock speed of 3.85 GHz, with a maximum turbo boost of 4.3 GHz to handle peak workloads effectively. Its 256 MB L3 cache ensures rapid data access, minimizing bottlenecks and latency in high-throughput environments.
The processor supports 12 memory channels with DRAM compatibility, ensuring expansive memory bandwidth to accommodate large-scale virtualization, big data analytics, or high-performance computing (HPC) use cases. With a TDP of 320 watts and a Socket SP5 interface, it is built for advanced multi-socket server configurations while maintaining thermal efficiency through robust infrastructure design. Although it does not offer TAA compliance, the unit is manufactured in Malaysia and offers dependable quality for data center deployment.
Ideal for enterprise, cloud, and virtualization deployments, the AMD EPYC 9374F empowers businesses with performance scaling and reduced processing latency. Its high core and thread count translate directly into accelerated multithreaded performance, increasing computing density and operational productivity in mission-critical infrastructure.
Specifications
Product Overview
Physical & Environmental
Package Type | OEM/Tray |
Die Size | Estimated at ~700 mm² per CCD |
Number of CCDs | 8 |
Max Operating Temperature | 90°C (TJ Max) |
Integrated Heat Spreader (IHS) | Yes |
Cloud Management & Licensing
Supported Virtualization | AMD-V with Nested Paging |
Secure Encrypted Virtualization (SEV) | Yes |
Cloud Enablement | Optimized for cloud-native applications |
Interfaces
Socket Compatibility | SP5 (LGA 6096) |
PCI Express Version | PCIe 5.0 |
PCIe Lanes | 128 |
Memory Bandwidth | 460.8 GB/s |
Max Memory Size | 6 TB |
Compliance & Origin
Country of Origin | Malaysia |
TAA Compliant | No |
RoHS Compliant | Yes |
ECC Memory Support | Yes |
Advanced Security Features
Hardware Root of Trust | Yes |
Secure Boot | Yes |
AMD Infinity Guard | Yes |
Memory Encryption | AMD SME & SEV |