Products Memory, Storage and Components AMD EPYC 9554P 64-Core 3.1G...

AMD EPYC 9554P 64-Core 3.1GHz Server Processor

VENDOR: AMD Mfg Part#: 100-000000804
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$5,650.36
$5,650.36
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MSRP: $7,104.00
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  • 64-core / 128-thread AMD EPYC architecture for intensive parallel workloads
  • 3.1 GHz base clock speed with up to 3.7 GHz boost for peak application performance
  • 256 MB L3 cache enhances throughput and data access speed
  • Socket SP5 interface ensures compatibility with modern server platforms
  • 12-channel DRAM memory support maximizes memory bandwidth
  • 360W TDP supports robust computing requirements

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Key Benefits

Eye-Insights
  • Offers extremely high core and thread counts ideal for virtualization and large-scale parallel applications
  • Supports advanced memory throughput via 12-channel DRAM configuration, crucial for data-intensive workloads
  • Maximizes ROI in data centers by reducing total processor count and optimizing power-performance ratio

Product Overview

The AMD EPYC 9554P is a 64-core/128-thread server processor with a base clock of 3.1 GHz and max boost of 3.7 GHz, purpose-built for demanding virtualization, cloud, and AI workloads. It features 256 MB of L3 cache, a 360W TDP, and supports 12 DRAM memory channels through a Socket SP5 interface. This high-density CPU enables scalable performance for enterprise deployments, offering significant compute throughput and memory bandwidth in a tray configuration designed for OEMs and integrators.

Specifications

Product Overview
Processor Type AMD EPYC
Model 9554P
Number of Cores 64
Number of Threads 128
Base Clock Speed 3.1 GHz
Max Boost Clock 3.7 GHz
L3 Cache Size 256 MB
Thermal Design Power (TDP) 360 W
Socket Type Socket SP5
Form Factor Tray (OEM only)
Processor Count 1

Wireless Features

Compliance & Origin
Country of Origin Malaysia
TAA Compliant No
RoHS Compliant Yes
ECC Memory Support Yes
Manufacturing Process 5nm FinFET (TSMC)

Advanced Security Features
AMD Infinity Guard Yes
Secure Memory Encryption (SME) Yes
Secure Encrypted Virtualization (SEV) Yes
Shadow Stack Yes
Hardware Root of Trust Yes
OS and VM Isolation Yes

Interfaces
Memory Interface 12-channel DDR5
Supported Memory Types DDR5 DRAM
PCI Express Version PCIe 5.0
PCIe Lane Count 128

Physical & Environmental
Package Type LGA (Land Grid Array)
Processor Package Dimensions 76mm x 80mm (approximate)
Maximum Operating Temperature (Tj Max) 95°C
Operating Temperature Range 10°C to 80°C
Heatsink Included No
Cooling Solution Not included

Cloud Management & Licensing
Market Segment Datacenter / Enterprise
Intended Use Server / HPC / Cloud / Virtualization
Bundled Software None
Licensing Type OEM Tray