Products Memory, Storage and Components LENOVO HTSINK MASSY, Single...

LENOVO HTSINK MASSY, Single Socket, Intel

VENDOR: LENOVO Mfg Part#: 4XF7A79752
  • No_media_available
1 0
Photo is for illustration purposes only. Actual product may be different.
$329.00
$329.00
Sale Sold out
Shipping calculated at checkout.
  • Designed for Intel single socket processors
  • Compatible with LENOVO enterprise systems
  • Reliable thermal management solution
  • OEM-manufactured for system compatibility

Shipping & Returns

All our products can be shipped anywhere in the Continental United States.

View our shipping and returns policy

View full details

Key Benefits

Eye-Insights
  • Engineered specifically for Intel single socket platforms, ensuring precise compatibility for LENOVO systems.
  • Manufactured by LENOVO, providing OEM reliability and consistent performance in managed environments.
  • Critical for maintaining optimal processor temperature, reducing thermal stress and improving lifecycle longevity.

Product Overview

The LENOVO HTSINK MASSY, Single Socket, Intel (part number 4XF7A79752) is a passive thermal accessory built for Intel-based single socket systems. Manufactured by LENOVO, this heatsink supports optimal thermal performance in compatible platforms. Although specific specification data is unavailable, its main role is to maintain CPU temperature stability and ensure long-term component integrity in enterprise environments. Ideal for IT admins using LENOVO platforms, this accessory helps minimize hardware failure risks associated with thermal issues.

Specifications

Product Overview
Product Type Passive CPU Heatsink
Form Factor Single Socket Passive Heatsink
Designed For Intel-based Single Socket Systems
Compatible Platforms Selected Lenovo Servers and Workstations
Cooling Method Passive Air Cooling
Application CPU Thermal Management
Supported Processor Architectures Intel Xeon (compatible models)
Material Aluminum or Copper (depending on model)
Weight
Power Requirements Not applicable (passive component)

Wireless Features

Compliance & Origin
Country of Origin
TAA Compliant
RoHS Compliant Yes
REACH Compliant Yes
WEEE Compliance Yes
UL Certification Yes (Platform Dependent)
CE Certification Yes

Advanced Security Features

Interfaces
Mounting Interface Socket Compatible Heatsink Mounting Mechanism

Physical & Environmental
Dimensions (W x H x D)
Operating Temperature Range 10°C to 35°C
Storage Temperature Range -40°C to 60°C
Operating Humidity Range 8% to 80% (non-condensing)
Storage Humidity Range 5% to 90% (non-condensing)
Thermal Design Power (TDP) Compatibility Up to platform-specific supported TDP
Cooling Fins Yes
Integrated Fan No (passive)
Mounting Orientation Vertical or Horizontal (Platform Dependent)
Heatsink Color Metallic / Silver

Cloud Management & Licensing