| Product Type | Air Baffle Kit |
| Compatible Platform | Lenovo ThinkEdge SE455 V3 |
| Application | Thermal management for M.2 components |
| Target Use Case | Server and edge computing environments |
| Cooling Method | Passive airflow direction |
| Form Factor | Custom fit for SE455 V3 chassis |
| Weight | 0.15 kg |
| Power Requirements | Not applicable (passive device) |
Lenovo ThinkEdge SE455 V3 M.2 Air Baffle Kit
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Regular price
$189.00
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Sale price
$189.00
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- Designed specifically for Lenovo ThinkEdge SE455 V3 systems
- Improves airflow over M.2 components to enhance cooling efficiency
- Helps maintain optimal operating temperatures for greater stability
- TAA compliant for use in regulated environments
- Manufactured in Mexico for verified origin and traceability
Shipping & Returns
Shipping & Returns
All our products can be shipped anywhere in the Continental United States.
Key Benefits
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- Engineered for seamless integration with the ThinkEdge SE455 V3, ensuring compatibility and performance
- Improves system thermal performance, reducing risk of overheating and enhancing hardware longevity
- TAA compliance supports use in public sector and government-regulated deployments
Product Overview
The Lenovo ThinkEdge SE455 V3 M.2 Air Baffle Kit is a specialized thermal management component engineered for server environments that utilize the SE455 V3 platform. Designed to direct and enhance airflow over M.2 components, the air baffle supports effective cooling, thereby maintaining optimal operational temperatures and contributing to system stability.
Compliant with TAA requirements and originating from Mexico, this air baffle kit reflects Lenovo’s commitment to quality and regulatory adherence in enterprise environments. It’s particularly useful in data centers, edge computing installations, and performance-critical settings where consistent thermal management is essential. The component aligns precisely with the physical layout of the SE455 V3 hardware, ensuring straightforward installation and long-term reliability.
For IT professionals and system integrators, this accessory offers a targeted cooling solution that serves to extend the lifespan of internal storage components and minimize thermal-related performance throttling, supporting overall system efficiency.
Specifications
Product Overview
Wireless Features
| Wireless Support | Not applicable |
Compliance & Origin
| Country of Origin | Mexico |
| TAA Compliant | Yes |
| RoHS Compliant | Yes |
| Manufacturer | Lenovo |
| Manufacturer Part Number | 4XF7A93023 |
| UPC | |
| REACH Compliant | Yes |
| WEEE Compliance | Yes |
| Packaging Type | Retail packaging |
Advanced Security Features
| Security Features | Not applicable for passive hardware |
Interfaces
| Interfaces | None (mechanical component) |
Physical & Environmental
| Mount Type | Internal chassis-mount (tool-less install) |
| Material | Plastic (engineered polymer) |
| Product Color | Black |
| Operating Temperature Range | 10°C to 35°C |
| Storage Temperature Range | -40°C to 60°C |
| Operating Humidity Range | 10% to 80% (non-condensing) |
| Dimensions (W x D x H) | 55 mm x 110 mm x 25 mm |
Cloud Management & Licensing
| Cloud Integration | Not applicable |
| Cloud Management Support | No |
