| Product Type | High Performance Heatsink |
| Form Factor | 2U Server Heat Sink |
| Compatible Systems | Lenovo ThinkSystem SR665 V3 2U |
| Designed For | High Thermal Load CPUs |
| Application | Data Center & Enterprise Servers |
| Power Requirements | Passive Cooling (No Power Required) |
| Material | Aluminum with Copper Base |
| Mounting Type | Screw-in with Spring Retention |
| Product Weight | Approx. 0.85 kg |
| Fan Included | No |
Lenovo ThinkSystem SR665 V3 2U High Performance Heatsink
Photo is for illustration purposes only. Actual product may be different.
Regular price
$289.00
Regular price
Sale price
$289.00
Unit price
per
Shipping calculated at checkout.
Couldn't load pickup availability
- Designed specifically for ThinkSystem SR665 V3 2U server
- High performance heatsink for superior thermal management
- TAA compliant for regulated industry use
- Manufactured in Mexico
- Optimized form factor for 2U server compatibility
Shipping & Returns
Shipping & Returns
All our products can be shipped anywhere in the Continental United States.
Key Benefits
Eye-Insights™ by Eye-In Technologies
AI-Powered Summaries from Online Customer Reviews
AI-Powered Summaries from Online Customer Reviews
Eye-Insights™ are generated by proprietary AI that analyzes real online customer reviews to highlight top pros and key product features. While we aim for accuracy, insights are provided “as-is” and individual results may vary.
- Purpose-built for Lenovo ThinkSystem SR665 V3 2U, ensuring a perfect thermal fit and compatibility
- TAA compliance enables use in government and enterprise sectors requiring strict regulatory adherence
- High-performance design supports stable operation under compute-intensive workloads
Product Overview
The Lenovo ThinkSystem SR665 V3 2U High Performance Heatsink is a precision-engineered thermal solution crafted for the ThinkSystem SR665 V3 2U server. Designed to address the significant thermal loads of high-performance processors, this heatsink ensures optimal cooling and protects against hardware degradation. Manufactured in Mexico and fully TAA compliant, it is suited for federal and enterprise settings. Supporting consistent performance under high loads, it’s an ideal solution for data centers and mission-critical IT infrastructures.
Specifications
Product Overview
Wireless Features
Compliance & Origin
| Country of Origin | Mexico |
| TAA Compliant | Yes |
| RoHS Compliance | Yes |
| Manufacturer Certification | Lenovo Qualified Thermal Solution |
| REACH Compliance | Yes |
Advanced Security Features
Interfaces
| Interface Type | Direct Contact Thermal Interface |
| Socket Compatibility | Socket SP5 (AMD EPYC Genoa) |
Physical & Environmental
| Dimensions (WxDxH) | 156 mm x 88 mm x 73 mm |
| Operating Temperature | 10°C to 35°C (50°F to 95°F) |
| Storage Temperature | -40°C to 60°C (-40°F to 140°F) |
| Operating Humidity | 8% to 90% (non-condensing) |
| Storage Humidity | 5% to 95% (non-condensing) |
| Thermal Design Power (TDP) Supported | Up to 360W |
