| Processor Type | AMD EPYC | 
| Model Number | 7262 | 
| Number of Cores | 8 | 
| Number of Threads | 16 | 
| Base Clock Frequency | 3.2 GHz | 
| Max Turbo Frequency | 3.4 GHz | 
| L3 Cache Size | 128 MB | 
| Architecture | Zen 2 | 
| Manufacturing Process | 7nm FinFET | 
| Platform Compatibility | Server | 
| Thermal Design Power (TDP) | 155 W | 
| Form Factor | Socketed (SP3) | 
AMD EPYC 7262 8-Core 3.2GHz Processor, SP3 Socket, 128MB Cache
 
 
 
 

Key Benefits
 
            
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- Ideal for virtualized workloads and multi-threaded applications due to 8-core/16-thread design
- High 128MB L3 cache optimizes data throughput in demanding environments
- Socket SP3 support enables compatibility with modern server motherboards
Product Overview
The AMD EPYC 7262 processor offers enterprise-class capabilities in a compact 8-core, 16-thread architecture. Designed for Socket SP3 infrastructure, this processor delivers a base clock speed of 3.2 GHz and supports a maximum turbo boost frequency of 3.4 GHz, providing efficient computational power for multitasking, virtualization, and server workloads. With a generous 128MB of L3 cache, it delivers fast data access and reduced bottlenecks to enhance performance across business-critical applications.
Engineered with a 155W thermal design power (TDP), the EPYC 7262 balances its power consumption while offering robust performance. Integrated with AMD's notable EPYC architecture, it is a reliable option for scalable server deployments in data centers or on-premise infrastructures. This processor benefits users looking for an affordable yet capable processor in environments requiring moderate to high parallel compute throughput.
Whether used in entry-level to mid-tier server configurations, the AMD EPYC 7262 offers a solid return on investment through its multi-core capabilities and efficient energy usage. While country of origin and TAA compliance information require inquiry, the core processor attributes make this a dependable foundation for business-scale computing.
Specifications
                      Product Overview
                      
                    
                    
                      Physical & Environmental
                      
                    
                    | Package Type | Socket SP3 (LGA4094) | 
| Die Size | Approx. 192 mm² per chiplet | 
| Number of Die Chiplets | 1 x CCD, 1 x IOD | 
| Max Operating Temperature (Tjunction) | 95°C | 
| Integrated Heat Spreader | Yes | 
                      Cloud Management & Licensing
                      
                    
                    | Virtualization Support | Yes—AMD-V | 
| Secure Encrypted Virtualization (SEV) | Yes | 
| Cloud-Scale Deployment Ready | Yes | 
| License Type | OEM / Tray or PIB depending on distribution | 
                      Interfaces
                      
                    
                    | Socket Type | Socket SP3 | 
| PCI Express Version | PCIe 4.0 | 
| PCI Express Lanes | 128 | 
| Memory Interface | 8-channel DDR4 | 
| Supported Memory Speed | Up to 3200 MHz | 
| Supported Memory Type | DDR4 RDIMM/LRDIMM | 
| Memory Bandwidth | Up to 204.8 GB/s | 
                      Compliance & Origin
                      
                    
                    | Country of Origin | |
| TAA Compliant | |
| RoHS Compliant | Yes | 
| Halogen Free | Yes | 
| ECC Memory Support | Yes | 
                      Advanced Security Features
                      
                    
                    | AMD Secure Processor | Yes | 
| Secure Memory Encryption (SME) | Yes | 
| Secure Encrypted Virtualization (SEV) | Yes | 
| Hardware Root of Trust | Yes | 
 
               
     
     
     
    